Cartes de prototypage, kits de fabrication

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus KitType Quantity PackageAccepted Specifications
OM13493UL

OM13493UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
3,254 -

RFQ

Bulk - Active Adapter, Breakout Boards 24 Pieces (4 Values - 6 Each) DHVQFN SMD to DIP
OM13491UL

OM13491UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
2,626 -

RFQ

Bulk - Active Adapter, Breakout Boards 42 Pieces (5 Values - Mixed Quantities) HWSON, MSOP, SO, VSSOP, XQFN SMD to DIP
OM13494UL

OM13494UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
3,745 -

RFQ

Bulk - Active Adapter, Breakout Boards 24 Pieces (4 Values - 6 Each) HVQFN SMD to DIP
OM13495UL

OM13495UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
2,245 -

RFQ

Bulk - Active Adapter, Breakout Boards 24 Pieces (4 Values - 6 Each) TSSOP SMD to DIP
OM13496UL

OM13496UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
3,991 -

RFQ

Bulk - Active Adapter, Breakout Boards 23 Pieces (4 Values - Mixed Quantities) QSOP, TSSOP28, XFBGA, XQFN SMD to DIP
OM13497UL

OM13497UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
3,220 -

RFQ

Bulk - Active Adapter, Breakout Boards 18 Pieces (3 Values - 6 Each) HTSSOP, VFBGA, XFBGA SMD to DIP
OM13492UL

OM13492UL

SURFACE MOUNT TO DIP EVALUATION

NXP USA Inc.
2,493 -

RFQ

Bulk - Obsolete Adapter, Breakout Boards 42 Pieces (7 Values - 6 Each) HVSON, MSOP, PCT, TSOP, TSSOP, XSON, WLCSP SMD to DIP
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur