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Supports pour CI, Transistors
| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XR2C-0311-NCONN SOCKET SIP 3POS GOLD Omron Electronics Inc-EMC Div |
2,556 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2A-1401-NCONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div |
451 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2C-2011-NCONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
612 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2A-0802CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
247 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2C1011NCONN SOCKET SIP 10POS GOLD Omron Electronics Inc-EMC Div |
353 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2A-0825CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
252 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2A-1411-NCONN IC DIP SOCKET 14POS GOLD Omron Electronics Inc-EMC Div |
2,495 | - |
RFQ |
Fiche technique |
Tube | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-1801-NCONN IC DIP SOCKET 18POS GOLD Omron Electronics Inc-EMC Div |
2,833 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2P2041CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
100 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-0815CONNECTORS - CONNECTOR Omron Electronics Inc-EMC Div |
107 | - |
RFQ |
Fiche technique |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
XR2A-1611-NCONN IC DIP SOCKET 16POS GOLD Omron Electronics Inc-EMC Div |
2,723 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2A-2411-NCONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div |
3,395 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-3201-NCONN IC DIP SOCKET 32POS GOLD Omron Electronics Inc-EMC Div |
3,308 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2C-2005CONN SOCKET SIP 20POS GOLD Omron Electronics Inc-EMC Div |
2,646 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A0815CONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
3,289 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-3205CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
2,960 | - |
RFQ |
Fiche technique |
Bulk,Box | XR2 | Active | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-0811-NCONN IC DIP SOCKET 8POS GOLD Omron Electronics Inc-EMC Div |
3,037 | - |
RFQ |
Fiche technique |
Bulk,Box | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-1611-NCONN SOCKET SIP 16POS GOLD Omron Electronics Inc-EMC Div |
3,098 | - |
RFQ |
Fiche technique |
Bulk,Box | XR2 | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-1501-NCONN SOCKET SIP 15POS GOLD Omron Electronics Inc-EMC Div |
2,830 | - |
RFQ |
Fiche technique |
Bulk | XR2 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-1601-NIC CONNECTOR Omron Electronics Inc-EMC Div |
3,324 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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