Bornes - Broches PC, connecteurs à borne unique

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series RoHS Insulation Part Status Termination Mounting Type Terminal Type Contact Finish Terminal Style Board Thickness Flange Diameter Contact Material Length - Overall Length - Above Flange Length - Below Flange Mounting Hole Diameter Pin Size - Above Flange Pin Size - Below Flange Contact Finish Thickness
75403-003LF

75403-003LF

CONN PC PIN SQUARE .025 GOLD

Amphenol ICC (FCI)
2,287 -

RFQ

75403-003LF

Fiche technique

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.460" (11.68mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 50.0µin (1.27µm)
76203-006LF

76203-006LF

CONN PC PIN SQUARE 0.025 GOLD

Amphenol ICC (FCI)
2,529 -

RFQ

76203-006LF

Fiche technique

Bag Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.480" (12.19mm) - - 0.034" ~ 0.036" (0.86mm ~ 0.91mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 50.0µin (1.27µm)
76151-035

76151-035

CONN PC PIN SQUARE .025 GOLD

Amphenol ICC (FCI)
3,812 -

RFQ

76151-035

Fiche technique

Bulk Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.890" (22.61mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
75401-001LF

75401-001LF

CONN PC PIN SQUARE 0.025 GOLD

Amphenol ICC (FCI)
26,557 -

RFQ

75401-001LF

Fiche technique

Bulk Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.345" (8.76mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
75403-044

75403-044

CONN PC PIN SQUARE 0.025 GOLD

Amphenol ICC (FCI)
2,849 -

RFQ

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.450" (11.43mm) - - 0.034" ~ 0.036" (0.86mm ~ 0.91mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 50.0µin (1.27µm)
76151-003LF

76151-003LF

CONN PC PIN SQUARE 0.025 GOLD

Amphenol ICC (FCI)
3,964 -

RFQ

76151-003LF

Fiche technique

Bulk Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.460" (11.68mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
76644-111

76644-111

RELIMATE TERMINAL TIN

Amphenol ICC (FCI)
2,516 -

RFQ

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Flanged, Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) 0.043" (1.10mm) Phosphor Bronze 0.540" (13.72mm) - 0.040" (1.02mm) 0.034" ~ 0.036" (0.86mm ~ 0.91mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
75401-012

75401-012

CONN PC PIN SQUARE 0.025 GOLD

Amphenol ICC (FCI)
3,094 -

RFQ

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.770" (19.56mm) - - 0.034" ~ 0.036" (0.86mm ~ 0.91mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
75409-001

75409-001

CONN PC PIN SQUARE .025 GOLD

Amphenol ICC (FCI)
3,534 -

RFQ

75409-001

Fiche technique

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.345" (8.76mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 15.0µin (0.38µm)
75483-017

75483-017

CONN PC PIN SQUARE

Amphenol ICC (FCI)
3,558 -

RFQ

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.640" (16.26mm) - - 0.034" ~ 0.036" (0.86mm ~ 0.91mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 50.0µin (1.27µm)
76230-402LF

76230-402LF

CONN PC PIN SQUARE .025 TIN

Amphenol ICC (FCI)
2,999 -

RFQ

76230-402LF

Fiche technique

Tape & Reel (TR) RoHS Non-Insulated Active Solder Through Hole Single Post Tin Pin Retention 0.093" ~ 0.125" (2.36mm ~ 3.18mm) - Phosphor Bronze 0.395" (10.03mm) - - 0.040" (1.02mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 100.0µin (2.54µm)
75401-003

75401-003

CONN PC PIN SQUARE .025 GOLD

Amphenol ICC (FCI)
3,334 -

RFQ

75401-003

Fiche technique

Bulk Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.460" (11.68mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
48283-058

48283-058

PV

Amphenol ICC (FCI)
2,090 -

RFQ

48283-058

Fiche technique

Tape & Reel (TR) BergPost® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Bronze 0.390" (9.91mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
48283-087LF

48283-087LF

PV

Amphenol ICC (FCI)
2,434 -

RFQ

48283-087LF

Fiche technique

Tape & Reel (TR) BergPost® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Bronze 0.463" (11.76mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
76494-130

76494-130

CONN HEADER

Amphenol ICC (FCI)
3,149 -

RFQ

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Flanged, Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) 0.090" (2.29mm) Phosphor Bronze 0.700" (17.78mm) - 0.140" (3.56mm) 0.034" ~ 0.036" (0.86mm ~ 0.91mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
76644-133

76644-133

RELIMATE TERMINAL TIN

Amphenol ICC (FCI)
3,727 -

RFQ

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Flanged, Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) 0.043" (1.10mm) Phosphor Bronze 0.510" (12.95mm) - 0.040" (1.02mm) 0.034" ~ 0.036" (0.86mm ~ 0.91mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
75401-010LF

75401-010LF

CONN PC PIN SQUARE 0.025 GOLD

Amphenol ICC (FCI)
3,992 -

RFQ

75401-010LF

Fiche technique

Tape & Reel (TR) Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Pin Retention 0.062" ~ 0.125" (1.57mm ~ 3.18mm) - Phosphor Bronze 0.700" (17.78mm) - - 0.032" ~ 0.034" (0.81mm ~ 0.86mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
75494-017LF

75494-017LF

CONN PC PIN SQUARE

Amphenol ICC (FCI)
3,921 -

RFQ

Tape & Reel (TR) Tri-Pin™ RoHS Non-Insulated Active Solder Through Hole Single Post Tin Pin Retention 0.120" (3.05mm) - Phosphor Bronze 0.420" (10.67mm) - - - 0.025" (0.64mm) Square 0.025" (0.64mm) Square 100.0µin (2.54µm)
71258-100

71258-100

CONN PC PIN SQUARE 0.025 GOLD

Amphenol ICC (FCI)
3,406 -

RFQ

71258-100

Fiche technique

Bulk Bergpin® RoHS Non-Insulated Active Solder Through Hole Single Post Gold Flanged, Pin Retention 0.093" ~ 0.125" (2.36mm ~ 3.18mm) 0.090" (2.29mm) Phosphor Bronze 0.480" (12.19mm) - 0.150" (3.81mm) 0.034" ~ 0.036" (0.86mm ~ 0.91mm) 0.025" (0.64mm) Square 0.025" (0.64mm) Square 30.0µin (0.76µm)
75404-006LF

75404-006LF

BERG PIN .550L (.435)TIN

Amphenol ICC (FCI)
2,308 -

RFQ

Tape & Reel (TR) RoHS - Active - - - - - - - - - - - - - - -
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1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur