Oscillateurs

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Package/Case Packaging Series ProductStatus BaseResonator Type Frequency Function Output Voltage-Supply FrequencyStability AbsolutePullRange(APR) OperatingTemperature SpreadSpectrumBandwidth Current-Supply(Max) Ratings MountingType Size/Dimension
DSC6001JI3B-004K000

DSC6001JI3B-004K000

MEMS OSC ULP LVCMOS -40C-85C 20P

Microchip Technology
2,096 -

RFQ

DSC6001JI3B-004K000

Fiche technique

4-VLGA Tube DSC60XXB Active MEMS XO (Standard) 4 kHz Enable/Disable CMOS 1.71V ~ 3.63V ±20ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.098 L x 0.079 W (2.50mm x 2.00mm)
DSC6001JI3B-004K000T

DSC6001JI3B-004K000T

MEMS OSC ULP LVCMOS -40C-85C 20P

Microchip Technology
3,995 -

RFQ

DSC6001JI3B-004K000T

Fiche technique

4-VLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 4 kHz Enable/Disable CMOS 1.71V ~ 3.63V ±20ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.098 L x 0.079 W (2.50mm x 2.00mm)
DSC6001ML2B-040.0000

DSC6001ML2B-040.0000

MEMS OSC ULP LVCMOS -40C-105C 25

Microchip Technology
3,688 -

RFQ

DSC6001ML2B-040.0000

Fiche technique

4-VFLGA Bag DSC60XXB Active MEMS XO (Standard) 40 MHz Enable/Disable CMOS 1.71V ~ 3.63V ±25ppm - -40°C ~ 105°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.079 L x 0.063 W (2.00mm x 1.60mm)
DSC6001ML2B-040.0000T

DSC6001ML2B-040.0000T

MEMS OSC ULP LVCMOS -40C-105C 25

Microchip Technology
2,454 -

RFQ

DSC6001ML2B-040.0000T

Fiche technique

4-VFLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 40 MHz Enable/Disable CMOS 1.71V ~ 3.63V ±25ppm - -40°C ~ 105°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.079 L x 0.063 W (2.00mm x 1.60mm)
DSC6003JI2B-025.0000

DSC6003JI2B-025.0000

MEMS OSC ULP LVCMOS -40C-85C 25P

Microchip Technology
3,208 -

RFQ

DSC6003JI2B-025.0000

Fiche technique

4-VLGA Tube DSC60XXB Active MEMS XO (Standard) 25 MHz Enable/Disable CMOS 1.71V ~ 3.63V ±25ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.098 L x 0.079 W (2.50mm x 2.00mm)
DSC6003JI2B-025.0000T

DSC6003JI2B-025.0000T

MEMS OSC ULP LVCMOS -40C-85C 25P

Microchip Technology
2,675 -

RFQ

DSC6003JI2B-025.0000T

Fiche technique

4-VLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 25 MHz Enable/Disable CMOS 1.71V ~ 3.63V ±25ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.098 L x 0.079 W (2.50mm x 2.00mm)
DSC6003MI2B-027.0000

DSC6003MI2B-027.0000

MEMS OSC ULP LVCMOS -40C-85C 25P

Microchip Technology
3,752 -

RFQ

DSC6003MI2B-027.0000

Fiche technique

4-VFLGA Bag DSC60XXB Active MEMS XO (Standard) 27 MHz Enable/Disable CMOS 1.71V ~ 3.63V ±25ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.079 L x 0.063 W (2.00mm x 1.60mm)
DSC6003MI2B-027.0000T

DSC6003MI2B-027.0000T

MEMS OSC ULP LVCMOS -40C-85C 25P

Microchip Technology
2,737 -

RFQ

DSC6003MI2B-027.0000T

Fiche technique

4-VFLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 27 MHz Enable/Disable CMOS 1.71V ~ 3.63V ±25ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.079 L x 0.063 W (2.00mm x 1.60mm)
DSC6011HE1B-084K000

DSC6011HE1B-084K000

MEMS OSC ULP LVCMOS -20C-70C 50P

Microchip Technology
2,427 -

RFQ

DSC6011HE1B-084K000

Fiche technique

4-VFLGA Bag DSC60XXB Active MEMS XO (Standard) 84 kHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -20°C ~ 70°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HE1B-084K000T

DSC6011HE1B-084K000T

MEMS OSC ULP LVCMOS -20C-70C 50P

Microchip Technology
3,923 -

RFQ

DSC6011HE1B-084K000T

Fiche technique

4-VFLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 84 kHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -20°C ~ 70°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HI1B-009.6000

DSC6011HI1B-009.6000

MEMS OSC ULP LVCMOS -40C-85C 50P

Microchip Technology
2,335 -

RFQ

DSC6011HI1B-009.6000

Fiche technique

4-VFLGA Bag DSC60XXB Active MEMS XO (Standard) 9.6 MHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HI1B-009.6000T

DSC6011HI1B-009.6000T

MEMS OSC ULP LVCMOS -40C-85C 50P

Microchip Technology
3,907 -

RFQ

DSC6011HI1B-009.6000T

Fiche technique

4-VFLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 9.6 MHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HI1B-016.0000

DSC6011HI1B-016.0000

MEMS OSC ULP LVCMOS -40C-85C 50P

Microchip Technology
2,527 -

RFQ

DSC6011HI1B-016.0000

Fiche technique

4-VFLGA Bag DSC60XXB Active MEMS XO (Standard) 16 MHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HI1B-016.0000T

DSC6011HI1B-016.0000T

MEMS OSC ULP LVCMOS -40C-85C 50P

Microchip Technology
2,918 -

RFQ

DSC6011HI1B-016.0000T

Fiche technique

4-VFLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 16 MHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HI1B-024.0000

DSC6011HI1B-024.0000

MEMS OSC ULP LVCMOS -40C-85C 50P

Microchip Technology
3,006 -

RFQ

DSC6011HI1B-024.0000

Fiche technique

4-VFLGA Bag DSC60XXB Active MEMS XO (Standard) 24 MHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HI1B-024.0000T

DSC6011HI1B-024.0000T

MEMS OSC ULP LVCMOS -40C-85C 50P

Microchip Technology
2,279 -

RFQ

DSC6011HI1B-024.0000T

Fiche technique

4-VFLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 24 MHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HI1B-025.0000

DSC6011HI1B-025.0000

MEMS OSC ULP LVCMOS -40C-85C 50P

Microchip Technology
2,374 -

RFQ

DSC6011HI1B-025.0000

Fiche technique

4-VFLGA Bag DSC60XXB Active MEMS XO (Standard) 25 MHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011HI1B-025.0000T

DSC6011HI1B-025.0000T

MEMS OSC ULP LVCMOS -40C-85C 50P

Microchip Technology
3,034 -

RFQ

DSC6011HI1B-025.0000T

Fiche technique

4-VFLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 25 MHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -40°C ~ 85°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.063 L x 0.047 W (1.60mm x 1.20mm)
DSC6011JE1B-840K000

DSC6011JE1B-840K000

MEMS OSC ULP LVCMOS -20C-70C 50P

Microchip Technology
2,049 -

RFQ

DSC6011JE1B-840K000

Fiche technique

4-VLGA Tube DSC60XXB Active MEMS XO (Standard) 840 kHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -20°C ~ 70°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.098 L x 0.079 W (2.50mm x 2.00mm)
DSC6011JE1B-840K000T

DSC6011JE1B-840K000T

MEMS OSC ULP LVCMOS -20C-70C 50P

Microchip Technology
3,141 -

RFQ

DSC6011JE1B-840K000T

Fiche technique

4-VLGA Tape & Reel (TR) DSC60XXB Active MEMS XO (Standard) 840 kHz Standby (Power Down) CMOS 1.71V ~ 3.63V ±50ppm - -20°C ~ 70°C - 1.3mA (Typ) AEC-Q100 Surface Mount 0.098 L x 0.079 W (2.50mm x 2.00mm)
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1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur