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Connecteurs rectangulaires - Entretoises de carte, Empileurs (carte à carte)

Numéro de pièce du fabricant	Disponibilité en stock	Prix	Quantité	Fiche technique	Packaging	Series	ProductStatus	NumberofPositions	Pitch	NumberofRows	RowSpacing	Length-OverallPin	Length-Post(Mating)	Length-StackHeight	Length-Tail	MountingType	Termination	ContactFinish-Post(Mating)	ContactFinishThickness-Post(Mating)
54121-808031450LF CONN HDR 3POS 0.1 STACK T/H Amphenol ICC (FCI)	2,196	-	RFQ	Fiche technique	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	3	0.100 (2.54mm)	1	-	0.925 (23.500mm)	0.234 (5.944mm)	0.571 (14.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
59132-F34-03-060LF CONN HDR 6POS 0.079 STACK T/H Amphenol ICC (FCI)	3,862	-	RFQ	Fiche technique	Bag	Minitek® 2.00mm	Active	6	0.079 (2.00mm)	2	0.079 (2.00mm)	0.614 (15.600mm)	0.260 (6.600mm)	0.236 (6.000mm)	0.118 (3.000mm)	Through Hole	Solder	Gold	8.00µin (0.203µm)
54122-107041200LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,725	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.232 (5.900mm)	0.472 (12.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54121-411041700LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,039	-	RFQ	Fiche technique	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	1.225 (31.115mm)	0.436 (11.074mm)	0.669 (17.000mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-807040800LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,021	-	RFQ	Fiche technique	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.390 (9.900mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54122-107041150LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,988	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	0.825 (20.955mm)	0.252 (6.400mm)	0.453 (11.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
59112-S26-02-040LF CONN HDR 4POS 0.079 STACK T/H Amphenol ICC (FCI)	3,875	-	RFQ	Fiche technique	Bulk	Minitek® 2.00mm	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.402 (10.200mm)	0.146 (3.700mm)	0.157 (4.000mm)	0.098 (2.500mm)	Through Hole	Solder	Gold	15.0µin (0.38µm)
69057-006LF CONN HDR 4POS 0.079 STACK SMD Amphenol ICC (FCI)	3,427	-	RFQ		Bag	Minitek® MezzSelect™, Basics+	Active	4	0.079 (2.00mm)	2	0.079 (2.00mm)	0.343 (8.712mm)	0.146 (3.700mm)	0.197 (5.000mm)	-	Surface Mount	Solder	Gold	30.0µin (0.76µm)
54112-109041300LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,363	-	RFQ	Fiche technique	Bag	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.418 (10.617mm)	0.512 (13.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54111-804050800LF CONN HDR 5POS 0.1 STACK T/H Amphenol ICC (FCI)	2,718	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	5	0.100 (2.54mm)	1	-	0.660 (16.764mm)	0.250 (6.350mm)	0.315 (8.000mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-802020800LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,791	-	RFQ		Bag	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	0.531 (13.500mm)	0.096 (2.450mm)	0.315 (8.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54111-802030850LF CONN HDR STACK Amphenol ICC (FCI)	3,804	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-
54111-118021450LF CONN HDR 2POS 0.1 STACK T/H Amphenol ICC (FCI)	2,643	-	RFQ		Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	2	0.100 (2.54mm)	1	-	1.102 (28.000mm)	0.436 (11.074mm)	0.571 (14.500mm)	0.095 (2.413mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-109041650LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,099	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.255 (6.477mm)	0.650 (16.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-109041600LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,077	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.275 (6.985mm)	0.630 (16.000mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	30.0µin (0.76µm)
54122-809041250LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	3,090	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	2	0.100 (2.54mm)	1.025 (26.035mm)	0.413 (10.490mm)	0.492 (12.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
54121-806061050LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	3,216	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	1	-	0.744 (18.900mm)	0.210 (5.334mm)	0.413 (10.500mm)	0.120 (3.050mm)	Through Hole	Solder	Gold, GXT™	15.0µin (0.38µm)
75970-393R04LF CONN HDR 4POS 0.1 STACK T/H Amphenol ICC (FCI)	2,812	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	4	0.100 (2.54mm)	1	-	0.515 (13.081mm)	0.130 (3.300mm)	0.256 (6.500mm)	0.130 (3.300mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-403060950LF CONN HDR 6POS 0.1 STACK T/H Amphenol ICC (FCI)	2,412	-	RFQ	Fiche technique	Bulk	BERGSTIK®, MezzSelect™, Basics+	Active	6	0.100 (2.54mm)	2	0.100 (2.54mm)	0.626 (15.900mm)	0.132 (3.353mm)	0.374 (9.500mm)	0.120 (3.050mm)	Through Hole	Solder	Tin	78.7µin (2.00µm)
54122-112062450LF CONN HDR STACK Amphenol ICC (FCI)	3,623	-	RFQ		Bag	*	Active	-	-	-	-	-	-	-	-	-	-	-	-