Connecteurs rectangulaires - Embases, prises, prises femelles

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus ConnectorType ContactType Style NumberofPositions NumberofPositionsLoaded Pitch-Mating NumberofRows RowSpacing-Mating MountingType Termination FasteningType ContactFinish-Mating ContactFinishThickness-Mating InsulationColor InsulationHeight ContactLength-Post OperatingTemperature MaterialFlammabilityRating ContactFinish-Post MatedStackingHeights IngressProtection
803-87-054-10-269101

803-87-054-10-269101

CONN SOCKET 54POS 0.1 GOLD PCB

Preci-Dip
3,000 -

RFQ

803-87-054-10-269101

Fiche technique

Bulk 803 Active Socket Female Socket Board to Board 54 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.435 (11.05mm) 0.116 (2.95mm) -55°C ~ 125°C UL94 V-0 Tin - -
346-87-159-41-035101

346-87-159-41-035101

CONN SOCKET 59POS 0.1 GOLD PCB

Preci-Dip
3,401 -

RFQ

346-87-159-41-035101

Fiche technique

Bulk 346 Active Socket Female Socket Board to Board 59 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold Flash Black 0.173 (4.40mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
346-87-159-41-036101

346-87-159-41-036101

CONN SOCKET 59POS 0.1 GOLD PCB

Preci-Dip
2,006 -

RFQ

346-87-159-41-036101

Fiche technique

Bulk 346 Active Socket Female Socket Board to Board 59 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold Flash Black 0.116 (2.95mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-83-049-20-002101

801-83-049-20-002101

CONN SOCKET 49P 0.1 GOLD PCB R/A

Preci-Dip
3,825 -

RFQ

801-83-049-20-002101

Fiche technique

Bulk 801 Active Socket Female Socket Board to Board 49 All 0.100 (2.54mm) 1 - Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.100 (2.54mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-87-044-53-001101

803-87-044-53-001101

CONN SOCKET 44POS 0.1 GOLD PCB

Preci-Dip
3,107 -

RFQ

803-87-044-53-001101

Fiche technique

Bulk 803 Active Socket Female Socket Board to Board 44 All 0.100 (2.54mm) 2 0.100 (2.54mm) Through Hole Wire Wrap Push-Pull Gold Flash Black 0.276 (7.00mm) 0.503 (12.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
801-87-044-53-001101

801-87-044-53-001101

CONN SOCKET 44POS 0.1 GOLD PCB

Preci-Dip
2,062 -

RFQ

801-87-044-53-001101

Fiche technique

Bulk 801 Active Socket Female Socket Board to Board 44 All 0.100 (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold Flash Black 0.276 (7.00mm) 0.503 (12.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
316-83-143-41-009101

316-83-143-41-009101

CONN SOCKET 43POS 0.1 GOLD PCB

Preci-Dip
2,988 -

RFQ

316-83-143-41-009101

Fiche technique

Bulk 316 Active Socket Female Socket Board to Board 43 All 0.100 (2.54mm) 1 - Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.512 (13.00mm) 0.126 (3.20mm) -55°C ~ 125°C UL94 V-0 Tin - -
310-83-148-41-105101

310-83-148-41-105101

CONN SOCKET 48POS 0.1 GOLD SMD

Preci-Dip
2,754 -

RFQ

310-83-148-41-105101

Fiche technique

Bulk 310 Active Socket Female Socket Board to Board 48 All 0.100 (2.54mm) 1 - Surface Mount Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.220 (5.60mm) - -55°C ~ 125°C UL94 V-0 Tin - -
310-83-148-41-205101

310-83-148-41-205101

CONN SOCKET 48P 0.1 GOLD SMD R/A

Preci-Dip
2,807 -

RFQ

310-83-148-41-205101

Fiche technique

Bulk 310 Active Socket Female Socket Board to Board 48 All 0.100 (2.54mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.100 (2.54mm) - -55°C ~ 125°C UL94 V-0 Tin - -
410-83-248-41-105101

410-83-248-41-105101

CONN SOCKET 48POS 0.1 GOLD SMD

Preci-Dip
3,773 -

RFQ

410-83-248-41-105101

Fiche technique

Bulk 410 Active Socket Female Socket Board to Board 48 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.220 (5.60mm) - -55°C ~ 125°C UL94 V-0 Tin - -
346-83-147-41-035101

346-83-147-41-035101

CONN SOCKET 47POS 0.1 GOLD PCB

Preci-Dip
2,444 -

RFQ

346-83-147-41-035101

Fiche technique

Bulk 346 Active Socket Female Socket Board to Board 47 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.173 (4.40mm) 0.150 (3.81mm) -55°C ~ 125°C UL94 V-0 Tin - -
346-83-147-41-036101

346-83-147-41-036101

CONN SOCKET 47POS 0.1 GOLD PCB

Preci-Dip
2,900 -

RFQ

346-83-147-41-036101

Fiche technique

Bulk 346 Active Socket Female Socket Board to Board 47 All 0.100 (2.54mm) 1 - Through Hole Press-Fit, Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.116 (2.95mm) 0.110 (2.79mm) -55°C ~ 125°C UL94 V-0 Tin - -
861-83-030-40-001101

861-83-030-40-001101

CONN SCKT 30P 0.039 GOLD SMD RA

Preci-Dip
3,168 -

RFQ

861-83-030-40-001101

Fiche technique

Bulk 861 Active Socket Female Socket Board to Board 30 All 0.039 (1.00mm) 1 - Surface Mount, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.087 (2.20mm) - -55°C ~ 125°C UL94 V-0 Tin - -
801-83-033-53-001101

801-83-033-53-001101

CONN SOCKET 33POS 0.1 GOLD PCB

Preci-Dip
2,198 -

RFQ

801-83-033-53-001101

Fiche technique

Bulk 801 Active Socket Female Socket Board to Board 33 All 0.100 (2.54mm) 1 - Through Hole Wire Wrap Push-Pull Gold 29.5µin (0.75µm) Black 0.276 (7.00mm) 0.503 (12.78mm) -55°C ~ 125°C UL94 V-0 Tin - -
803-83-054-30-480101

803-83-054-30-480101

CONN SOCKET 54POS 0.1 GOLD SMD

Preci-Dip
3,138 -

RFQ

803-83-054-30-480101

Fiche technique

Bulk 803 Active Socket Female Socket Board to Board 54 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.165 (4.20mm) - -55°C ~ 125°C UL94 V-0 Tin - -
805-83-042-10-003101

805-83-042-10-003101

CONN SOCKET 42POS 0.1 GOLD PCB

Preci-Dip
3,530 -

RFQ

805-83-042-10-003101

Fiche technique

Bulk 805 Active Socket Female Socket Board to Board 42 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.312 (7.92mm) 0.121 (3.08mm) -55°C ~ 125°C UL94 V-0 Tin - -
851-83-035-30-001101

851-83-035-30-001101

CONN SOCKET 35POS 0.05 GOLD SMD

Preci-Dip
2,236 -

RFQ

851-83-035-30-001101

Fiche technique

Bulk 851 Active Socket Female Socket Board to Board 35 All 0.050 (1.27mm) 1 - Surface Mount Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.203 (5.16mm) - -55°C ~ 125°C UL94 V-0 Tin - -
803-83-070-30-002101

803-83-070-30-002101

CONN SOCKET 70POS 0.1 GOLD SMD

Preci-Dip
2,588 -

RFQ

803-83-070-30-002101

Fiche technique

Bulk 803 Active Socket Female Socket Board to Board 70 All 0.100 (2.54mm) 2 0.100 (2.54mm) Surface Mount Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.220 (5.60mm) - -55°C ~ 125°C UL94 V-0 Tin - -
805-87-096-10-012101

805-87-096-10-012101

CONN SOCKET 96POS 0.1 GOLD PCB

Preci-Dip
3,443 -

RFQ

Bulk 805 Active Socket Female Socket Board to Board 96 All 0.100 (2.54mm) 3 0.100 (2.54mm) Through Hole Solder Push-Pull Gold Flash Black 0.165 (4.20mm) 0.125 (3.18mm) -55°C ~ 125°C UL94 V-0 Tin - -
853-83-048-20-001101

853-83-048-20-001101

CONN SOCKET 48P 0.05 GOLD PCB RA

Preci-Dip
2,215 -

RFQ

853-83-048-20-001101

Fiche technique

Bulk 853 Active Socket Female Socket Board to Board 48 All 0.050 (1.27mm) 2 0.050 (1.27mm) Through Hole, Right Angle Solder Push-Pull Gold 29.5µin (0.75µm) Black 0.128 (3.25mm) 0.130 (3.30mm) -55°C ~ 125°C UL94 V-0 Tin - -
Total 10461 Record«Prev1... 492493494495496497498499...524Next»
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur