Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-87-120-13-061117

514-87-120-13-061117

CONN SOCKET PGA 120POS GOLD

Preci-Dip
3,889 -

RFQ

514-87-120-13-061117

Fiche technique

Bulk 514 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-004101

116-83-652-41-004101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,913 -

RFQ

116-83-652-41-004101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-072-11-061101

550-10-072-11-061101

PGA SOLDER TAIL

Preci-Dip
2,016 -

RFQ

550-10-072-11-061101

Fiche technique

Bulk 550 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-013101

116-87-648-41-013101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,748 -

RFQ

116-87-648-41-013101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-100-10-000112

614-87-100-10-000112

CONN SOCKET PGA 100POS GOLD

Preci-Dip
3,348 -

RFQ

614-87-100-10-000112

Fiche technique

Bulk 614 Active PGA 100 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-221-18-091101

510-83-221-18-091101

CONN SOCKET PGA 221POS GOLD

Preci-Dip
3,339 -

RFQ

510-83-221-18-091101

Fiche technique

Bulk 510 Active PGA 221 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-121-13-061135

546-87-121-13-061135

CONN SOCKET PGA 121POS GOLD

Preci-Dip
3,796 -

RFQ

546-87-121-13-061135

Fiche technique

Bulk 546 Active PGA 121 (13 x 13) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-121-13-061136

546-87-121-13-061136

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,000 -

RFQ

546-87-121-13-061136

Fiche technique

Bulk 546 Active PGA 121 (13 x 13) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-013101

116-83-642-41-013101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,614 -

RFQ

116-83-642-41-013101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-002101

510-83-223-18-002101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
3,070 -

RFQ

510-83-223-18-002101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-091101

510-83-223-18-091101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
3,508 -

RFQ

510-83-223-18-091101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-092101

510-83-223-18-092101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
2,328 -

RFQ

510-83-223-18-092101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-093101

510-83-223-18-093101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
3,117 -

RFQ

510-83-223-18-093101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-223-18-094101

510-83-223-18-094101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
2,599 -

RFQ

510-83-223-18-094101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-084-10-031112

614-83-084-10-031112

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,647 -

RFQ

614-83-084-10-031112

Fiche technique

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-084-10-001112

614-83-084-10-001112

CONN SOCKET PGA 84POS GOLD

Preci-Dip
2,435 -

RFQ

614-83-084-10-001112

Fiche technique

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-224-18-091101

510-83-224-18-091101

CONN SOCKET PGA 224POS GOLD

Preci-Dip
3,235 -

RFQ

510-83-224-18-091101

Fiche technique

Bulk 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-013101

116-87-650-41-013101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,068 -

RFQ

116-87-650-41-013101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-225-18-019101

510-83-225-18-019101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
3,786 -

RFQ

510-83-225-18-019101

Fiche technique

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-085-11-041112

614-83-085-11-041112

CONN SOCKET PGA 85POS GOLD

Preci-Dip
2,817 -

RFQ

614-83-085-11-041112

Fiche technique

Bulk 614 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur