Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-312-41-006101

116-83-312-41-006101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,762 -

RFQ

116-83-312-41-006101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-012101

116-87-210-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,137 -

RFQ

116-87-210-41-012101

Fiche technique

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-001101

110-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,171 -

RFQ

110-83-318-41-001101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-318-41-001151

110-83-318-41-001151

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,444 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-318-41-001101

614-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,708 -

RFQ

614-87-318-41-001101

Fiche technique

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-004101

116-83-306-41-004101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,208 -

RFQ

116-83-306-41-004101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-316-41-001101

115-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,918 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-316-41-005101

117-83-316-41-005101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,963 -

RFQ

117-83-316-41-005101

Fiche technique

Bulk 117 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-012101

116-83-310-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,063 -

RFQ

116-83-310-41-012101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-87-108-41-005101

917-87-108-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip
3,436 -

RFQ

917-87-108-41-005101

Fiche technique

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-87-108-41-053101

917-87-108-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip
2,349 -

RFQ

917-87-108-41-053101

Fiche technique

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-87-208-41-005101

917-87-208-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip
3,436 -

RFQ

917-87-208-41-005101

Fiche technique

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-005101

110-83-320-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,137 -

RFQ

110-83-320-41-005101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-605101

110-83-320-41-605101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,373 -

RFQ

110-83-320-41-605101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-420-41-005101

110-83-420-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,457 -

RFQ

110-83-420-41-005101

Fiche technique

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-314-41-035101

146-87-314-41-035101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,163 -

RFQ

146-87-314-41-035101

Fiche technique

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-87-208-41-053101

917-87-208-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip
2,446 -

RFQ

917-87-208-41-053101

Fiche technique

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-432-41-001101

110-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,740 -

RFQ

110-87-432-41-001101

Fiche technique

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-007101

116-87-312-41-007101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,362 -

RFQ

116-87-312-41-007101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-324-41-001101

115-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,588 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur