Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-316-41-004101

116-83-316-41-004101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,659 -

RFQ

116-83-316-41-004101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-007101

116-83-324-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,749 -

RFQ

116-83-324-41-007101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-007101

116-83-424-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,768 -

RFQ

116-83-424-41-007101

Fiche technique

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-624-41-035101

146-83-624-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,594 -

RFQ

146-83-624-41-035101

Fiche technique

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-624-41-036101

146-83-624-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,665 -

RFQ

146-83-624-41-036101

Fiche technique

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-013101

116-87-312-41-013101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,542 -

RFQ

116-87-312-41-013101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-950-41-001101

115-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,545 -

RFQ

Bulk 115 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-640-41-117101

114-83-640-41-117101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,786 -

RFQ

114-83-640-41-117101

Fiche technique

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-640-41-134161

114-83-640-41-134161

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,294 -

RFQ

114-83-640-41-134161

Fiche technique

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-004101

116-87-318-41-004101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
3,114 -

RFQ

116-87-318-41-004101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-428-41-105101

117-87-428-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,687 -

RFQ

117-87-428-41-105101

Fiche technique

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-640-41-105161

110-87-640-41-105161

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,408 -

RFQ

110-87-640-41-105161

Fiche technique

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-320-41-002101

124-83-320-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,760 -

RFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-009101

116-87-328-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,586 -

RFQ

116-87-328-41-009101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-009101

116-87-428-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,211 -

RFQ

116-87-428-41-009101

Fiche technique

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-084-13-081101

510-87-084-13-081101

CONN SOCKET PGA 84POS GOLD

Preci-Dip
3,851 -

RFQ

510-87-084-13-081101

Fiche technique

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-610-10-002101

299-83-610-10-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,365 -

RFQ

299-83-610-10-002101

Fiche technique

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-009101

116-83-422-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,271 -

RFQ

116-83-422-41-009101

Fiche technique

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-640-31-012101

614-87-640-31-012101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,263 -

RFQ

614-87-640-31-012101

Fiche technique

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-430-41-105101

117-83-430-41-105101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip
3,499 -

RFQ

117-83-430-41-105101

Fiche technique

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 6061626364656667...142Next»
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur