Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-83-650-41-035101

146-83-650-41-035101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,371 -

RFQ

146-83-650-41-035101

Fiche technique

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-650-41-036101

146-83-650-41-036101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,787 -

RFQ

146-83-650-41-036101

Fiche technique

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-004101

116-87-632-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,820 -

RFQ

116-87-632-41-004101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-012101

116-83-652-41-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,738 -

RFQ

116-83-652-41-012101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-184-17-081101

510-87-184-17-081101

CONN SOCKET PGA 184POS GOLD

Preci-Dip
3,375 -

RFQ

510-87-184-17-081101

Fiche technique

Bulk 510 Active PGA 184 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-068-10-001117

514-87-068-10-001117

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,078 -

RFQ

514-87-068-10-001117

Fiche technique

Bulk 514 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-068-10-061117

514-87-068-10-061117

CONN SOCKET PGA 68POS GOLD

Preci-Dip
3,670 -

RFQ

514-87-068-10-061117

Fiche technique

Bulk 514 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-009101

116-87-650-41-009101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,117 -

RFQ

116-87-650-41-009101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-196-14-000101

510-87-196-14-000101

CONN SOCKET PGA 196POS GOLD

Preci-Dip
2,931 -

RFQ

510-87-196-14-000101

Fiche technique

Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-120-13-001101

510-83-120-13-001101

CONN SOCKET PGA 120POS GOLD

Preci-Dip
2,024 -

RFQ

510-83-120-13-001101

Fiche technique

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-652-41-001101

122-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
2,214 -

RFQ

122-83-652-41-001101

Fiche technique

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-652-41-001101

123-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,000 -

RFQ

123-83-652-41-001101

Fiche technique

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-184-15-001101

510-87-184-15-001101

CONN SOCKET PGA 184POS GOLD

Preci-Dip
2,782 -

RFQ

510-87-184-15-001101

Fiche technique

Bulk 510 Active PGA 184 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-120-13-061101

510-83-120-13-061101

CONN SOCKET PGA 120POS GOLD

Preci-Dip
2,409 -

RFQ

510-83-120-13-061101

Fiche technique

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-620-10-002101

299-83-620-10-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,929 -

RFQ

299-83-620-10-002101

Fiche technique

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-121-13-001101

510-83-121-13-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,359 -

RFQ

510-83-121-13-001101

Fiche technique

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-121-13-041101

510-83-121-13-041101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
3,529 -

RFQ

510-83-121-13-041101

Fiche technique

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-121-13-061101

510-83-121-13-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,564 -

RFQ

510-83-121-13-061101

Fiche technique

Bulk 510 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-624-10-002101

299-87-624-10-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,724 -

RFQ

299-87-624-10-002101

Fiche technique

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-008101

116-87-648-41-008101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,159 -

RFQ

116-87-648-41-008101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 9596979899100101102...142Next»
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur