Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
D2824-42

D2824-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.
2,780 -

RFQ

D2824-42

Fiche technique

Tube D2 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
AR 28-HZL/01-TT

AR 28-HZL/01-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components
1,148 -

RFQ

AR 28-HZL/01-TT

Fiche technique

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
4591

4591

CONN TRANSIST TO-5 4POS TIN

Keystone Electronics
2,132 -

RFQ

4591

Fiche technique

Bulk - Active Transistor, TO-5 4 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled
AR 16-HZL/07-TT

AR 16-HZL/07-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components
1,976 -

RFQ

AR 16-HZL/07-TT

Fiche technique

Tube - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
111-43-320-41-001000

111-43-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
212 -

RFQ

111-43-320-41-001000

Fiche technique

Tube 111 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
917-43-210-41-005000

917-43-210-41-005000

CONN SOCKET TRANSIST TO100 10POS

Mill-Max Manufacturing Corp.
168 -

RFQ

917-43-210-41-005000

Fiche technique

Tube 917 Active Transistor, TO-100 10 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-87-314-41-001101

123-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
1,064 -

RFQ

123-87-314-41-001101

Fiche technique

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-43-624-41-001000

115-43-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
133 -

RFQ

115-43-624-41-001000

Fiche technique

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
214-44-628-01-670800

214-44-628-01-670800

CONN IC DIP SOCKET 28POS TIN

Mill-Max Manufacturing Corp.
219 -

RFQ

214-44-628-01-670800

Fiche technique

Tube 214 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
382

382

CONN IC DIP SOCKET 28POS

Adafruit Industries LLC
2,998 -

RFQ

382

Fiche technique

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) - - - - - - - - - - - -
XR2C-2011-N

XR2C-2011-N

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div
612 -

RFQ

XR2C-2011-N

Fiche technique

Bulk XR2 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
D2928-42

D2928-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.
165 -

RFQ

D2928-42

Fiche technique

Tube D2 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
210-93-632-41-001000

210-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
345 -

RFQ

210-93-632-41-001000

Fiche technique

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-43-632-41-001000

210-43-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,346 -

RFQ

210-43-632-41-001000

Fiche technique

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-87-328-41-134161

114-87-328-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,775 -

RFQ

114-87-328-41-134161

Fiche technique

Box 114 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-43-328-41-003000

115-43-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
251 -

RFQ

115-43-328-41-003000

Fiche technique

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-4518-10

22-4518-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,042 -

RFQ

22-4518-10

Fiche technique

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-93-628-41-003000

115-93-628-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
209 -

RFQ

115-93-628-41-003000

Fiche technique

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-328-41-003000

115-93-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
137 -

RFQ

115-93-328-41-003000

Fiche technique

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6518-10

32-6518-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
889 -

RFQ

32-6518-10

Fiche technique

Tube 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 1415161718192021...1100Next»
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur