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Supports pour CI, Transistors
| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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20-9513-11HCONN IC DIP SOCKET 20POS GOLD Aries Electronics |
3,426 | - |
RFQ |
Fiche technique |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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16-810-90TWRCONN IC DIP SOCKET 16POS TIN Aries Electronics |
2,518 | - |
RFQ |
Fiche technique |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
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18-0503-20CONN SOCKET SIP 18POS GOLD Aries Electronics |
2,315 | - |
RFQ |
Fiche technique |
Bulk | 0503 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
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18-0503-30CONN SOCKET SIP 18POS GOLD Aries Electronics |
2,020 | - |
RFQ |
Fiche technique |
Bulk | 0503 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
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16-3508-201CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
3,154 | - |
RFQ |
Fiche technique |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-3508-301CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
3,713 | - |
RFQ |
Fiche technique |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-822-90CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
3,099 | - |
RFQ |
Fiche technique |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 |
|
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510-83-208-17-081101CONN SOCKET PGA 208POS GOLD Preci-Dip |
2,359 | - |
RFQ |
Fiche technique |
Bulk | 510 | Active | PGA | 208 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
03-0511-11CONN SOCKET SIP 3POS GOLD Aries Electronics |
2,495 | - |
RFQ |
Fiche technique |
Bulk | 511 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
13-0501-20CONN SOCKET SIP 13POS TIN Aries Electronics |
3,401 | - |
RFQ |
Fiche technique |
Bulk | 501 | Active | SIP | 13 (1 x 13) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
13-0501-30CONN SOCKET SIP 13POS TIN Aries Electronics |
3,517 | - |
RFQ |
Fiche technique |
Bulk | 501 | Active | SIP | 13 (1 x 13) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-71250-10CONN SOCKET SIP 10POS TIN Aries Electronics |
3,384 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-7350-10CONN SOCKET SIP 10POS TIN Aries Electronics |
2,367 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-7400-10CONN SOCKET SIP 10POS TIN Aries Electronics |
3,685 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-7410-10CONN SOCKET SIP 10POS TIN Aries Electronics |
3,325 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-7450-10CONN SOCKET SIP 10POS TIN Aries Electronics |
3,568 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-7475-10CONN SOCKET SIP 10POS TIN Aries Electronics |
3,864 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-7500-10CONN SOCKET SIP 10POS TIN Aries Electronics |
2,618 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-7550-10CONN SOCKET SIP 10POS TIN Aries Electronics |
3,499 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-7560-10CONN SOCKET SIP 10POS TIN Aries Electronics |
3,638 | - |
RFQ |
Fiche technique |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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