Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-711250-10

20-711250-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,483 -

RFQ

20-711250-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-71219-10

20-71219-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,332 -

RFQ

20-71219-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-71250-10

20-71250-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,210 -

RFQ

20-71250-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7350-10

20-7350-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,053 -

RFQ

20-7350-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7354-10

20-7354-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,636 -

RFQ

20-7354-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7355-10

20-7355-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,022 -

RFQ

20-7355-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7360-10

20-7360-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,200 -

RFQ

20-7360-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7390-10

20-7390-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,685 -

RFQ

20-7390-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7394-10

20-7394-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,058 -

RFQ

20-7394-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7400-10

20-7400-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,236 -

RFQ

20-7400-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7405-10

20-7405-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,005 -

RFQ

20-7405-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7415-10

20-7415-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,316 -

RFQ

20-7415-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7420-10

20-7420-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,564 -

RFQ

20-7420-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7425-10

20-7425-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,873 -

RFQ

20-7425-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7430-10

20-7430-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,675 -

RFQ

20-7430-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7435-10

20-7435-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,755 -

RFQ

20-7435-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7438-10

20-7438-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,751 -

RFQ

20-7438-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7440-10

20-7440-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,490 -

RFQ

20-7440-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7450-10

20-7450-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
3,196 -

RFQ

20-7450-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-7453-10

20-7453-10

CONN SOCKET SIP 20POS TIN

Aries Electronics
2,508 -

RFQ

20-7453-10

Fiche technique

Bulk 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Record«Prev1... 104105106107108109110111...217Next»
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur