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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSWLF.020 2OZSLD WIRE NO-CLEAN 96.5/3/.5 2OZ. Chip Quik Inc. |
3,286 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
SMDLTLFPT4SOLDER PASTE NO CLEAN SN42/BI57. Chip Quik Inc. |
2,652 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
SMD2180-25000SOLDER SPHERES SN63/PB37 .016 ( Chip Quik Inc. |
2,349 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.016 (0.40mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD291SNLT4SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
2,887 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
SMD2170-25000SOLDER SPHERES SN63/PB37 .014 ( Chip Quik Inc. |
3,052 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014 (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMDSWLF.006 2GSOLDER WIRE SN96.5/AG3/CU0.5 Chip Quik Inc. |
3,727 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006 (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.07 oz (2g) | - | - |
|
SMD3SW.020 2OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
3,363 | - |
RFQ |
Fiche technique |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020 (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SMD291SNL15T4SOLDER PASTE TWO PART MIX Chip Quik Inc. |
3,777 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste, Two Part Mix | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 0.53 oz (15g) | 24 Months | Date of Manufacture |
|
SMD2150-25000SOLDER SPHERES SN63/PB37 .010 ( Chip Quik Inc. |
2,339 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.010 (0.25mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
RASWLF.020 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,008 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
SMD291AXT5SOLDER PASTE NO CLEAN 63SN/37PB Chip Quik Inc. |
3,310 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
SMD2140-25000SOLDER SPHERES SN63/PB37 .008 ( Chip Quik Inc. |
2,212 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.008 (0.20mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
RASWLF.015 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,539 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
SMD4300AX10SOLDER PASTE WATER SOL 10CC Chip Quik Inc. |
2,419 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
NC191AX35T5SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3,038 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMD2036-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,795 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.018 (0.46mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
BARSN99.3CU0.7-8OZSOLDER BAR SN99.3/CU0.7 8OZ 227G Chip Quik Inc. |
2,454 | - |
RFQ |
Fiche technique |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 0.5 lb (227g) | - | - |
|
SMD3SW.015 100GSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
2,170 | - |
RFQ |
Fiche technique |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.015 (0.38mm) | 354°F (179°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - |
|
SMD4300SNL10SOLDER PASTE WATER SOL LF 10CC Chip Quik Inc. |
3,223 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2028-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,642 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.014 (0.36mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
