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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TS391AX500CTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
3,883 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Cartridge, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
SMD2SWLF.031 .7OZLF SOLDER WIRE POCKET PACK 99.3/ Chip Quik Inc. |
3,500 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Lead Free | Tube, 0.7 oz (19.85g) | - | - |
|
RASW.031 4OZSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,794 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
SMDSWLF.031 .7OZLF SOLDER WIRE POCKET PACK 96.5/ Chip Quik Inc. |
3,169 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Lead Free | Tube, 0.7 oz (19.85g) | - | - |
|
SMD2SW.031 2OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,247 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SMD2SW.020 2OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
2,829 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
SSWS-T5-50GSOLDER PASTE WATER SOLUBLE 63/37 SRA Soldering Products |
2,433 | - |
RFQ |
Fiche technique |
Bag | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | - | Rosin Mildly Activated (RMA), Water Soluble | - | 5 | - | Jar, 1.76 oz (50g) | 24 Months | Date of Manufacture |
|
SMD4300SNL10T4SLDR PST WATR SOL SAC305 T4 10CC Chip Quik Inc. |
3,623 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2SWLT.040 20GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
2,817 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.7 oz (20g) | - | - |
|
4900P-25GLEAD FREE NO CLEAN SOLDER PASTE MG Chemicals |
2,871 | - |
RFQ |
Fiche technique |
Bulk | 4900 | Active | Solder Paste | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | - | 423 ~ 430°F (217 ~ 221°C) | No-Clean | - | - | Lead Free | Syringe, 0.88 oz (25g) | 24 Months | Date of Manufacture |
|
NC191SNL50T5SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
3,561 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
SSNC-T5-50G63/37 SOLDER PASTE T5 - 50 GRAM SRA Soldering Products |
3,214 | - |
RFQ |
Fiche technique |
Bag | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SSLTNC-T5-35GLOW TEMPERATURE LEAD FREE SOLDER SRA Soldering Products |
3,620 | - |
RFQ |
Fiche technique |
Bag | - | Active | Solder Paste | Sn42Bi57Ag1 (42/57/1) | - | 279°F (137°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SSWS-35GSOLDER PASTE WATER SOLUBLE 63/37 SRA Soldering Products |
3,191 | - |
RFQ |
Fiche technique |
Bag | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | - | Water Soluble | - | 3 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
NC191LTA50T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,458 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
1354225LOCTITE WS 300 97SCT3V 75G SYRIN LOCTITE |
3,429 | - |
RFQ |
Bulk | WS300 | Not For New Designs | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | - | Lead Free | Syringe, 2.65 oz (75g) | 6 Months | Date of Manufacture | |
|
WBNCSAC20LEAD FREE NO-CLEAN FLUX CORE SIL SRA Soldering Products |
2,460 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD4300SNL250T5SOLDER PASTE SAC305 250G T5 Chip Quik Inc. |
3,773 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
TS991SNL500T3SOLDER PASTE THERMALLY STABLE NC Chip Quik Inc. |
3,255 | - |
RFQ |
Fiche technique |
Bulk | CHIPQUIK® | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 3 | Lead Free | Jar, 17.64 oz (500g) | 12 Months | Date of Manufacture |
|
24-7068-7609SOLDER FLUX-CORED/275 .015 1LB Kester Solder |
195 | - |
RFQ |
Fiche technique |
Bulk | 275 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
