Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-132-14-001101

510-83-132-14-001101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,832 -

RFQ

510-83-132-14-001101

Fiche technique

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-002101

510-87-223-18-002101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
2,335 -

RFQ

510-87-223-18-002101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-091101

510-87-223-18-091101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
3,178 -

RFQ

510-87-223-18-091101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-092101

510-87-223-18-092101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
2,884 -

RFQ

510-87-223-18-092101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-093101

510-87-223-18-093101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
2,888 -

RFQ

510-87-223-18-093101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-223-18-094101

510-87-223-18-094101

CONN SOCKET PGA 223POS GOLD

Preci-Dip
3,786 -

RFQ

510-87-223-18-094101

Fiche technique

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-001101

116-87-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
2,266 -

RFQ

116-87-648-41-001101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-132-14-071101

510-83-132-14-071101

CONN SOCKET PGA 132POS GOLD

Preci-Dip
3,973 -

RFQ

510-83-132-14-071101

Fiche technique

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-628-10-002101

299-87-628-10-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,065 -

RFQ

299-87-628-10-002101

Fiche technique

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-224-18-091101

510-87-224-18-091101

CONN SOCKET PGA 224POS GOLD

Preci-Dip
3,407 -

RFQ

510-87-224-18-091101

Fiche technique

Bulk 510 Active PGA 224 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-964-41-001101

612-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
3,838 -

RFQ

612-83-964-41-001101

Fiche technique

Bulk 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-133-14-071101

510-83-133-14-071101

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,689 -

RFQ

510-83-133-14-071101

Fiche technique

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-17-001101

510-87-225-17-001101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
3,153 -

RFQ

510-87-225-17-001101

Fiche technique

Bulk 510 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-17-061101

510-87-225-17-061101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
2,700 -

RFQ

510-87-225-17-061101

Fiche technique

Bulk 510 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-15-000101

510-87-225-15-000101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
2,043 -

RFQ

510-87-225-15-000101

Fiche technique

Bulk 510 Active PGA 225 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-225-18-019101

510-87-225-18-019101

CONN SOCKET PGA 225POS GOLD

Preci-Dip
2,112 -

RFQ

510-87-225-18-019101

Fiche technique

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-004101

116-83-632-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
2,430 -

RFQ

116-83-632-41-004101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-013101

116-83-328-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,006 -

RFQ

116-83-328-41-013101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-013101

116-83-428-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
3,615 -

RFQ

116-83-428-41-013101

Fiche technique

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-013101

116-83-628-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,060 -

RFQ

116-83-628-41-013101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 100101102103104105106107...142Next»
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur