Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-83-068-10-001117

514-83-068-10-001117

CONN SOCKET PGA 68POS GOLD

Preci-Dip
3,406 -

RFQ

514-83-068-10-001117

Fiche technique

Bulk 514 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-068-10-061117

514-83-068-10-061117

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,243 -

RFQ

514-83-068-10-061117

Fiche technique

Bulk 514 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-241-18-071101

510-87-241-18-071101

CONN SOCKET PGA 241POS GOLD

Preci-Dip
2,997 -

RFQ

510-87-241-18-071101

Fiche technique

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-241-18-072101

510-87-241-18-072101

CONN SOCKET PGA 241POS GOLD

Preci-Dip
2,255 -

RFQ

510-87-241-18-072101

Fiche technique

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-626-10-002101

299-83-626-10-002101

CONN IC DIP SOCKET 26POS GOLD

Preci-Dip
2,284 -

RFQ

299-83-626-10-002101

Fiche technique

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-143-15-081101

510-83-143-15-081101

CONN SOCKET PGA 143POS GOLD

Preci-Dip
2,655 -

RFQ

510-83-143-15-081101

Fiche technique

Bulk 510 Active PGA 143 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-642-41-004101

116-87-642-41-004101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
3,495 -

RFQ

116-87-642-41-004101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-068-11-061101

550-80-068-11-061101

PGA SOLDER TAIL

Preci-Dip
2,646 -

RFQ

550-80-068-11-061101

Fiche technique

Bulk 550 Active PGA 68 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-068-11-071101

550-80-068-11-071101

PGA SOLDER TAIL

Preci-Dip
3,068 -

RFQ

550-80-068-11-071101

Fiche technique

Bulk 550 Active PGA 68 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-144-15-001101

510-83-144-15-001101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,402 -

RFQ

510-83-144-15-001101

Fiche technique

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-144-15-081101

510-83-144-15-081101

CONN SOCKET PGA 144POS GOLD

Preci-Dip
3,808 -

RFQ

510-83-144-15-081101

Fiche technique

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-068-10-061101

550-80-068-10-061101

PGA SOLDER TAIL

Preci-Dip
3,940 -

RFQ

550-80-068-10-061101

Fiche technique

Bulk 550 Active PGA 68 (10 x 10) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-15-001101

510-83-145-15-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
2,371 -

RFQ

510-83-145-15-001101

Fiche technique

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-15-002101

510-83-145-15-002101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
3,974 -

RFQ

510-83-145-15-002101

Fiche technique

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-15-081101

510-83-145-15-081101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
2,757 -

RFQ

510-83-145-15-081101

Fiche technique

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-145-17-001101

510-83-145-17-001101

CONN SOCKET PGA 145POS GOLD

Preci-Dip
3,863 -

RFQ

510-83-145-17-001101

Fiche technique

Bulk 510 Active PGA 145 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-650-41-002101

124-83-650-41-002101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,626 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-069-11-001101

550-80-069-11-001101

PGA SOLDER TAIL

Preci-Dip
3,954 -

RFQ

550-80-069-11-001101

Fiche technique

Bulk 550 Active PGA 69 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-069-11-061101

550-80-069-11-061101

PGA SOLDER TAIL

Preci-Dip
2,754 -

RFQ

550-80-069-11-061101

Fiche technique

Bulk 550 Active PGA 69 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-146-15-061101

510-83-146-15-061101

CONN SOCKET PGA 146POS GOLD

Preci-Dip
2,309 -

RFQ

510-83-146-15-061101

Fiche technique

Bulk 510 Active PGA 146 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 2821 Record«Prev1... 102103104105106107108109...142Next»
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur