Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-210-41-005101

110-83-210-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,622 -

RFQ

110-83-210-41-005101

Fiche technique

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-005101

110-83-310-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,556 -

RFQ

110-83-310-41-005101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-001101

110-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,200 -

RFQ

110-87-320-41-001101

Fiche technique

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-001151

110-87-320-41-001151

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
2,650 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-310-41-105161

110-87-310-41-105161

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,650 -

RFQ

110-87-310-41-105161

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-006101

116-87-310-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,301 -

RFQ

116-87-310-41-006101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-006101

116-87-610-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,553 -

RFQ

116-87-610-41-006101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-308-41-001101

614-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,862 -

RFQ

614-83-308-41-001101

Fiche technique

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-210-41-001101

115-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,651 -

RFQ

Bulk 115 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-007101

116-87-210-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,670 -

RFQ

116-87-210-41-007101

Fiche technique

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-003101

116-87-316-41-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,395 -

RFQ

116-87-316-41-003101

Fiche technique

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-312-31-012101

614-83-312-31-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,968 -

RFQ

614-83-312-31-012101

Fiche technique

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-316-41-003101

115-83-316-41-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,653 -

RFQ

115-83-316-41-003101

Fiche technique

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-004101

116-87-308-41-004101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,362 -

RFQ

116-87-308-41-004101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-314-41-001101

614-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,852 -

RFQ

614-83-314-41-001101

Fiche technique

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-105101

110-83-314-41-105101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,172 -

RFQ

110-83-314-41-105101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-020-17-400-TR

540-88-020-17-400-TR

CONN SOCKET PLCC 20POS TIN

Preci-Dip
2,305 -

RFQ

540-88-020-17-400-TR

Fiche technique

Tape & Reel (TR) 540 Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
115-83-310-41-001101

115-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,007 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-306-41-001101

121-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,122 -

RFQ

121-83-306-41-001101

Fiche technique

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-306-41-001101

122-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,588 -

RFQ

122-83-306-41-001101

Fiche technique

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur