Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-87-308-41-001101

612-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,713 -

RFQ

612-87-308-41-001101

Fiche technique

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-304-41-009101

116-83-304-41-009101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,827 -

RFQ

116-83-304-41-009101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-306-41-001101

612-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,494 -

RFQ

612-83-306-41-001101

Fiche technique

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-306-41-001101

122-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,938 -

RFQ

122-87-306-41-001101

Fiche technique

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-306-41-001101

123-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,237 -

RFQ

123-87-306-41-001101

Fiche technique

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-308-41-005101

110-83-308-41-005101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,146 -

RFQ

110-83-308-41-005101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-308-41-605101

110-83-308-41-605101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,617 -

RFQ

110-83-308-41-605101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-006101

116-83-306-41-006101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,645 -

RFQ

116-83-306-41-006101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-312-41-001101

115-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,606 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-005101

110-87-314-41-005101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,127 -

RFQ

110-87-314-41-005101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-605101

110-87-314-41-605101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,066 -

RFQ

110-87-314-41-605101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-605101

110-83-316-41-605101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,950 -

RFQ

110-83-316-41-605101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-020-17-400

540-88-020-17-400

CONN SOCKET PLCC 20POS TIN

Preci-Dip
2,802 -

RFQ

540-88-020-17-400

Fiche technique

Bulk 540 Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-87-316-41-018101

116-87-316-41-018101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,283 -

RFQ

116-87-316-41-018101

Fiche technique

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-422-41-117101

114-87-422-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,011 -

RFQ

114-87-422-41-117101

Fiche technique

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-328-01-777101

110-87-328-01-777101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,205 -

RFQ

110-87-328-01-777101

Fiche technique

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 14 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-322-41-117101

114-87-322-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,993 -

RFQ

114-87-322-41-117101

Fiche technique

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-310-41-001101

122-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,896 -

RFQ

122-83-310-41-001101

Fiche technique

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-308-41-117101

114-83-308-41-117101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,134 -

RFQ

114-83-308-41-117101

Fiche technique

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-308-41-134161

114-83-308-41-134161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,981 -

RFQ

114-83-308-41-134161

Fiche technique

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur