Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-273-21-121101

510-83-273-21-121101

CONN SOCKET PGA 273POS GOLD

Preci-Dip
2,658 -

RFQ

510-83-273-21-121101

Fiche technique

Bulk 510 Active PGA 273 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-241-19-101101

510-83-241-19-101101

CONN SOCKET PGA 241POS GOLD

Preci-Dip
3,224 -

RFQ

510-83-241-19-101101

Fiche technique

Bulk 510 Active PGA 241 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-121-13-061135

546-83-121-13-061135

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,073 -

RFQ

546-83-121-13-061135

Fiche technique

Bulk 546 Active PGA 121 (13 x 13) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-121-13-061136

546-83-121-13-061136

CONN SOCKET PGA 121POS GOLD

Preci-Dip
2,311 -

RFQ

546-83-121-13-061136

Fiche technique

Bulk 546 Active PGA 121 (13 x 13) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-243-19-081101

510-83-243-19-081101

CONN SOCKET PGA 243POS GOLD

Preci-Dip
3,740 -

RFQ

510-83-243-19-081101

Fiche technique

Bulk 510 Active PGA 243 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-101-13-061112

614-83-101-13-061112

CONN SOCKET PGA 101POS GOLD

Preci-Dip
2,468 -

RFQ

614-83-101-13-061112

Fiche technique

Bulk 614 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-124-13-041112

614-87-124-13-041112

CONN SOCKET PGA 124POS GOLD

Preci-Dip
2,057 -

RFQ

614-87-124-13-041112

Fiche technique

Bulk 614 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-132-13-041101

550-80-132-13-041101

PGA SOLDER TAIL

Preci-Dip
2,648 -

RFQ

550-80-132-13-041101

Fiche technique

Bulk 550 Active PGA 132 (13 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-132-14-071101

550-80-132-14-071101

PGA SOLDER TAIL

Preci-Dip
2,436 -

RFQ

550-80-132-14-071101

Fiche technique

Bulk 550 Active PGA 132 (14 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-296-19-131111

517-87-296-19-131111

CONN SOCKET PGA 296POS GOLD

Preci-Dip
2,526 -

RFQ

517-87-296-19-131111

Fiche technique

Bulk 517 Active PGA 296 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-279-19-081101

510-83-279-19-081101

CONN SOCKET PGA 279POS GOLD

Preci-Dip
2,951 -

RFQ

510-83-279-19-081101

Fiche technique

Bulk 510 Active PGA 279 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-133-14-071101

550-80-133-14-071101

PGA SOLDER TAIL

Preci-Dip
3,006 -

RFQ

550-80-133-14-071101

Fiche technique

Bulk 550 Active PGA 133 (14 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-280-19-081101

510-83-280-19-081101

CONN SOCKET PGA 280POS GOLD

Preci-Dip
2,176 -

RFQ

510-83-280-19-081101

Fiche technique

Bulk 510 Active PGA 280 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-281-19-081101

510-83-281-19-081101

CONN SOCKET PGA 281POS GOLD

Preci-Dip
2,703 -

RFQ

510-83-281-19-081101

Fiche technique

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-321-17-101111

517-87-321-17-101111

CONN SOCKET PGA 321POS GOLD

Preci-Dip
3,228 -

RFQ

517-87-321-17-101111

Fiche technique

Bulk 517 Active PGA 321 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-013101

116-83-652-41-013101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,620 -

RFQ

116-83-652-41-013101

Fiche technique

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-127-16-091117

514-83-127-16-091117

CONN SOCKET PGA 127POS GOLD

Preci-Dip
2,415 -

RFQ

514-83-127-16-091117

Fiche technique

Bulk 514 Active PGA 127 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-325-18-111111

517-87-325-18-111111

CONN SOCKET PGA 325POS GOLD

Preci-Dip
2,292 -

RFQ

517-87-325-18-111111

Fiche technique

Bulk 517 Active PGA 325 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-100-15-001101

550-10-100-15-001101

PGA SOLDER TAIL

Preci-Dip
3,788 -

RFQ

550-10-100-15-001101

Fiche technique

Bulk 550 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-132-13-041112

614-87-132-13-041112

CONN SOCKET PGA 132POS GOLD

Preci-Dip
3,394 -

RFQ

614-87-132-13-041112

Fiche technique

Bulk 614 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur