Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-87-478M26-131148

514-87-478M26-131148

CONN SOCKET BGA 478POS GOLD

Preci-Dip
3,663 -

RFQ

514-87-478M26-131148

Fiche technique

Bulk 514 Active BGA 478 (26 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-480M29-001148

514-87-480M29-001148

CONN SOCKET BGA 480POS GOLD

Preci-Dip
2,504 -

RFQ

514-87-480M29-001148

Fiche technique

Bulk 514 Active BGA 480 (29 x 29) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-360M19-001101

558-10-360M19-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,777 -

RFQ

558-10-360M19-001101

Fiche technique

Bulk 558 Active PGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-83-388M26-001148

514-83-388M26-001148

CONN SOCKET BGA 388POS GOLD

Preci-Dip
3,399 -

RFQ

514-83-388M26-001148

Fiche technique

Bulk 514 Active BGA 388 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-528-21-121147

546-87-528-21-121147

CONN SOCKET PGA 528POS GOLD

Preci-Dip
3,755 -

RFQ

546-87-528-21-121147

Fiche technique

Bulk 546 Active PGA 528 (21 x 21) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-388M26-001152

550-10-388M26-001152

BGA SOLDER TAIL

Preci-Dip
3,935 -

RFQ

550-10-388M26-001152

Fiche technique

Bulk 550 Active BGA 388 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-87-529-21-121147

546-87-529-21-121147

CONN SOCKET PGA 529POS GOLD

Preci-Dip
3,955 -

RFQ

546-87-529-21-121147

Fiche technique

Bulk 546 Active PGA 529 (21 x 21) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-545-17-000147

546-87-545-17-000147

CONN SOCKET PGA 545POS GOLD

Preci-Dip
3,070 -

RFQ

546-87-545-17-000147

Fiche technique

Bulk 546 Active PGA 545 (17 x 17) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-419-19-111147

546-83-419-19-111147

CONN SOCKET PGA 419POS GOLD

Preci-Dip
3,482 -

RFQ

546-83-419-19-111147

Fiche technique

Bulk 546 Active PGA 419 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-560M33-001166

550-10-560M33-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,201 -

RFQ

550-10-560M33-001166

Fiche technique

Bulk 550 Active BGA 560 (33 x 33) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-420-19-111147

546-83-420-19-111147

CONN SOCKET PGA 420POS GOLD

Preci-Dip
3,284 -

RFQ

546-83-420-19-111147

Fiche technique

Bulk 546 Active PGA 420 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-352M26-001104

558-10-352M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,704 -

RFQ

558-10-352M26-001104

Fiche technique

Bulk 558 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-500M30-001148

514-87-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip
2,116 -

RFQ

514-87-500M30-001148

Fiche technique

Bulk 514 Active BGA 500 (30 x 30) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-400M20-000148

514-83-400M20-000148

CONN SOCKET BGA 400POS GOLD

Preci-Dip
3,468 -

RFQ

514-83-400M20-000148

Fiche technique

Bulk 514 Active BGA 400 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-296-19-131144

614-83-296-19-131144

CONN SOCKET PGA 296POS GOLD

Preci-Dip
2,993 -

RFQ

614-83-296-19-131144

Fiche technique

Bulk 614 Active PGA 296 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-352M26-001105

518-77-352M26-001105

CONN SOCKET PGA 352POS GOLD

Preci-Dip
2,560 -

RFQ

518-77-352M26-001105

Fiche technique

Bulk 518 Active PGA 352 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-87-504M29-001148

514-87-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip
2,887 -

RFQ

514-87-504M29-001148

Fiche technique

Bulk 514 Active BGA 504 (29 x 29) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-356M26-001104

558-10-356M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
2,331 -

RFQ

558-10-356M26-001104

Fiche technique

Bulk 558 Active BGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-400M20-000152

550-10-400M20-000152

BGA SOLDER TAIL

Preci-Dip
2,991 -

RFQ

550-10-400M20-000152

Fiche technique

Bulk 550 Active BGA 400 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-357M19-001104

558-10-357M19-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,005 -

RFQ

558-10-357M19-001104

Fiche technique

Bulk 558 Active BGA 357 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

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