Supports pour CI, Transistors

Photo : Numéro de pièce du fabricant Disponibilité en stock Prix Quantité Fiche technique Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-83-478M26-131148

514-83-478M26-131148

CONN SOCKET BGA 478POS GOLD

Preci-Dip
3,036 -

RFQ

514-83-478M26-131148

Fiche technique

Bulk 514 Active BGA 478 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-600M35-001148

514-87-600M35-001148

CONN SOCKET BGA 600POS GOLD

Preci-Dip
3,064 -

RFQ

514-87-600M35-001148

Fiche technique

Bulk 514 Active BGA 600 (35 x 35) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-480M29-001148

514-83-480M29-001148

CONN SOCKET BGA 480POS GOLD

Preci-Dip
2,690 -

RFQ

514-83-480M29-001148

Fiche technique

Bulk 514 Active BGA 480 (29 x 29) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-478M26-131152

550-10-478M26-131152

BGA SOLDER TAIL

Preci-Dip
2,256 -

RFQ

550-10-478M26-131152

Fiche technique

Bulk 550 Active BGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-480M29-001152

550-10-480M29-001152

BGA SOLDER TAIL

Preci-Dip
3,285 -

RFQ

550-10-480M29-001152

Fiche technique

Bulk 550 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-456M26-001101

558-10-456M26-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
2,546 -

RFQ

558-10-456M26-001101

Fiche technique

Bulk 558 Active PGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-420M26-001106

518-77-420M26-001106

CONN SOCKET PGA 420POS GOLD

Preci-Dip
2,203 -

RFQ

518-77-420M26-001106

Fiche technique

Bulk 518 Active PGA 420 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-432M31-001104

558-10-432M31-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
2,280 -

RFQ

558-10-432M31-001104

Fiche technique

Bulk 558 Active BGA 432 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-432M31-001105

518-77-432M31-001105

CONN SOCKET PGA 432POS GOLD

Preci-Dip
3,008 -

RFQ

518-77-432M31-001105

Fiche technique

Bulk 518 Active PGA 432 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
546-83-528-21-121147

546-83-528-21-121147

CONN SOCKET PGA 528POS GOLD

Preci-Dip
2,747 -

RFQ

546-83-528-21-121147

Fiche technique

Bulk 546 Active PGA 528 (21 x 21) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-529-21-121147

546-83-529-21-121147

CONN SOCKET PGA 529POS GOLD

Preci-Dip
2,709 -

RFQ

546-83-529-21-121147

Fiche technique

Bulk 546 Active PGA 529 (21 x 21) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-545-17-000147

546-83-545-17-000147

CONN SOCKET PGA 545POS GOLD

Preci-Dip
3,303 -

RFQ

546-83-545-17-000147

Fiche technique

Bulk 546 Active PGA 545 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-500M30-001148

514-83-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip
2,107 -

RFQ

514-83-500M30-001148

Fiche technique

Bulk 514 Active BGA 500 (30 x 30) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-432M31-001106

518-77-432M31-001106

CONN SOCKET PGA 432POS GOLD

Preci-Dip
2,922 -

RFQ

518-77-432M31-001106

Fiche technique

Bulk 518 Active PGA 432 (31 x 31) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
514-83-504M29-001148

514-83-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip
2,726 -

RFQ

514-83-504M29-001148

Fiche technique

Bulk 514 Active BGA 504 (29 x 29) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-500M30-001152

550-10-500M30-001152

BGA SOLDER TAIL

Preci-Dip
2,465 -

RFQ

550-10-500M30-001152

Fiche technique

Bulk 550 Active BGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-504M29-001152

550-10-504M29-001152

BGA SOLDER TAIL

Preci-Dip
2,147 -

RFQ

550-10-504M29-001152

Fiche technique

Bulk 550 Active BGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-478M26-131101

558-10-478M26-131101

PGA SOLDER TAIL 1.27MM

Preci-Dip
3,339 -

RFQ

558-10-478M26-131101

Fiche technique

Bulk 558 Active PGA 478 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-480M29-001101

558-10-480M29-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
3,245 -

RFQ

558-10-480M29-001101

Fiche technique

Bulk 558 Active PGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-456M26-001104

558-10-456M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip
3,258 -

RFQ

558-10-456M26-001104

Fiche technique

Bulk 558 Active BGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
1500+
1500+ Moyenne quotidienne des demandes de devis (RFQ)
20,000.000
20,000.000 Unité standard du produit
1800+
1800+ Fabricants du monde entier
15,000+
15,000+ Stock disponible
Fudong Communication (Shenzhen) Group Co., Ltd.

Accueil

Fudong Communication (Shenzhen) Group Co., Ltd.

Produit

Fudong Communication (Shenzhen) Group Co., Ltd.

Téléphone

Fudong Communication (Shenzhen) Group Co., Ltd.

Utilisateur