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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC3SW.020 0.3OZSOLDER WIRE MINI POCKET PACK 62/ Chip Quik Inc. |
3,792 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020 (0.51mm) | 354°F (179°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Tube, 0.3 oz (8.51g) | - | - |
|
NC2SWLF.015 0.2OZLF SOLDER WIRE MINI POCKET PACK Chip Quik Inc. |
3,922 | - |
RFQ |
Fiche technique |
Bulk | CHIPQUIK® | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015 (0.38mm) | 441°F (227°C) | No-Clean | - | - | - | Tube, 0.2 oz (5.66g) | - | - |
|
WBRA633731-2OZWIRE SOLDER , ROSIN ACTIVATED, 6 SRA Soldering Products |
2,210 | - |
RFQ |
Fiche technique |
Box | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | - | - | Leaded | Spool, 2 oz (56.70g) | 24 Months | Date of Manufacture |
|
WBNCC633731-2OZNO-CLEAN FLUX CORE SOLDER, 63/37 SRA Soldering Products |
2,261 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 2 oz (56.70g) | - | - |
|
NC2SW.015 0.2OZSOLDER WIRE MINI POCKET PACK 60/ Chip Quik Inc. |
3,100 | - |
RFQ |
Fiche technique |
Bulk | CHIPQUIK® | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015 (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | - | Leaded | Tube, 0.2 oz (5.66g) | - | - |
|
NC2SW.015 1OZSOLDER WIRE 60/40 TIN/LEAD (SN60 Chip Quik Inc. |
3,512 | - |
RFQ |
Fiche technique |
Bulk | CHIPQUIK® | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015 (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | - | Leaded | Spool, 1 oz (28.35g) | - | - |
|
TS391AX50THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,861 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
WBRA633731-4OZWIRE SOLDER , ROSIN ACTIVATED, 6 SRA Soldering Products |
2,262 | - |
RFQ |
Fiche technique |
Box | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | - | - | Leaded | Spool, 4 oz (113.40g) | 24 Months | Date of Manufacture |
|
WBNCSAC20-2OZLEAD FREE NO-CLEAN FLUX CORE SIL SRA Soldering Products |
2,349 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
WBNCC633720-4OZNO-CLEAN FLUX CORE SOLDER, 63/37 SRA Soldering Products |
2,314 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
SMD2215-25000SOLDER SPHERES SN63/PB37 .030 D Chip Quik Inc. |
2,178 | - |
RFQ |
Fiche technique |
Jar | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.030 (0.76mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD2205-25000SOLDER SPHERES SN63/PB37 .025 D Chip Quik Inc. |
2,601 | - |
RFQ |
Fiche technique |
Jar | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.025 (0.64mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
EXB-SN96.5AG3.0CU0.5-0.5LBSOLDER BAR SN96.5/AG3.0/CU0.5 0. Chip Quik Inc. |
3,699 | - |
RFQ |
Fiche technique |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Leaded | Bar, 0.5 lb (227g) | - | - |
|
4901-112GSOLDER LF SN99 21GAUGE .25LBS MG Chemicals |
2,997 | - |
RFQ |
Fiche technique |
Spool | 4901 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.032 (0.81mm) | 442°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 4 oz (113.40g) | 60 Months | - |
|
NC4SW.031 1LBSOLDER WIRE 93.5/5/1.5 LEAD/TIN/ Chip Quik Inc. |
2,211 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.031 (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
NC4SW.020 1LBSOLDER WIRE 93.5/5/1.5 LEAD/TIN/ Chip Quik Inc. |
2,779 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.020 (0.51mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMD2SWLF.031 8OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,723 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
SMD2SW.031 .7OZSOLDER WIRE POCKET PACK 60/40 TI Chip Quik Inc. |
2,708 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | - | Leaded | Tube, 0.7 oz (19.85g) | - | - |
|
TS391LT250THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,574 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD291AX250T5SOLDER PASTE SN63/PB37 250G T5 Chip Quik Inc. |
3,159 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
