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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSWLF.006 10GSOLDER WIRE SN96.5/AG3/CU0.5 Chip Quik Inc. |
2,262 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006 (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - |
|
RASW.020 1LBSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,667 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
SMD2SWLF.012 100GLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,745 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.012 (0.31mm) | 441°F (227°C) | No-Clean, Water Soluble | 28 AWG, 30 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - |
|
BARSN99.3CU0.7SOLDER BAR SN99.3/CU0.7 1LB SUPE Chip Quik Inc. |
2,722 | - |
RFQ |
Fiche technique |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - |
|
WBARS99.3/.7SN99.3/CU.7 1 LB. BAR SRA Soldering Products |
3,547 | - |
RFQ |
Fiche technique |
Bag | SUPER-PURE™ | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | - | - | - | - | Lead Free | Bar, 1 lb (453.59g) | - | - |
|
SMD291AX250T4SLDR PST NO-CLEAN 63/37 T4 250G Chip Quik Inc. |
3,165 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD4300AX250T4SLDR PST WATR SOL 63/37 T4 250G Chip Quik Inc. |
2,161 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
T0051388799WSW SAC L0 SN3,0AG0,5CU3,5% Apex Tool Group |
3,854 | - |
RFQ |
Fiche technique |
Spool | Weller® | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | - | No-Clean | - | - | Lead Free | Spool, 8.8 oz (250g) | - | - |
|
4865-454GSOLDER NO-CLEAN 63/37 1 LB MG Chemicals |
2,314 | - |
RFQ |
Fiche technique |
Spool | 4860 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
4875-454GSOLDER NO-CLEAN 60/40 1 LB MG Chemicals |
3,061 | - |
RFQ |
Fiche technique |
Spool | 4870 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032 (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
4885-454GSOLDER RA 63/37 .032 1 LBS MG Chemicals |
3,328 | - |
RFQ |
Fiche technique |
Spool | 4880 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
4895-454GSOLDER RA 60/40 .032 1 LB MG Chemicals |
3,282 | - |
RFQ |
Fiche technique |
Spool | 4890 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032 (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
4894-454GSOLDER RA 60/40 .025 1 LB MG Chemicals |
2,886 | - |
RFQ |
Fiche technique |
Spool | 4890 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.025 (0.64mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
4884-454GSOLDER RA 63/37 .025 1 LBS MG Chemicals |
2,717 | - |
RFQ |
Fiche technique |
Spool | 4880 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025 (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
SMD291SNL250T4SLDR PST NO-CLEAN SAC305 T4 250G Chip Quik Inc. |
2,009 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
SMD4300SNL250T4SLDR PST WATR SOL SAC305 T4 250G Chip Quik Inc. |
2,526 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
TS391AXTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,887 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
TS391LTTHERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
3,165 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
SMDSWLF.008 50GLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,723 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008 (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 32 AWG, 35 SWG | - | Lead Free | Spool, 1.76 oz (50g) | - | - |
|
SMDSWLT.040 50GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
3,735 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 1.8 oz (50g) | - | - |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
