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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WC96L2062PSACSAC 305 WATER SOLUBLE FLUX 8 OZ. Canfield Technologies |
2,363 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
15-7340-0062SOLDER SOLID WIRE .062 4LB SPL Kester Solder |
2,229 | - |
RFQ |
Fiche technique |
Bulk | Solid Core Wire | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.062 (1.57mm) | 565 ~ 574°F (296 ~ 301°C) | - | 14 AWG, 16 SWG | - | Leaded | Spool, 4 lbs (1.81kg) | - | - |
|
WC96L2031ESAC 305 NO CLEAN 8 OZ .031 DIA. Canfield Technologies |
2,738 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
RC96L2031EAG3SAC 305 ROSIN FLUX 8 OZ. .031 DI Canfield Technologies |
2,601 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
38683260/40 370 3% .064DIA. 14AWG Multicore |
2,529 | - |
RFQ |
Fiche technique |
Bulk | 370 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.064 (1.63mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
|
39710263/37 400 2% .048DIA 16AWG Multicore |
2,193 | - |
RFQ |
Fiche technique |
Bulk | C400 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.048 (1.22mm) | 361°F (183°C) | No-Clean | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
38686263/37 CRYSL 502 2% .032DIA 20AWG Multicore |
2,458 | - |
RFQ |
Fiche technique |
Bulk | C502 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
39546563/37 CRYSL 502 3% .064DIA 14AWG Multicore |
3,175 | - |
RFQ |
Fiche technique |
Bulk | C502 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.064 (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
CC96L2031ESAC 305 NO CLEAN FLUX 8 OZ .031 Canfield Technologies |
3,586 | - |
RFQ |
Fiche technique |
Spool | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Rosin Mildly Activated (RMA) | - | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
38682760/40 370 3% .032DIA 20AWG Multicore |
3,245 | - |
RFQ |
Fiche technique |
Bulk | 370 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032 (0.81mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
|
38682460/40 370 3% .024DIA 22AWG Multicore |
3,904 | - |
RFQ |
Fiche technique |
Bulk | 370 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.024 (0.61mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
|
86-7068-0118SOLDER SOLID WIRE .118 2.5KG SP Kester Solder |
2,304 | - |
RFQ |
Fiche technique |
Bulk | Solid Core Wire | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.118 (3.00mm) | 423 ~ 424°F (217 ~ 218°C) | - | 9 AWG, 11 SWG | - | Lead Free | Spool, 5.51 lbs (2.5kg) | - | - |
|
67383297SC 400 2% .064DIA 14AWG Multicore |
2,141 | - |
RFQ |
Fiche technique |
Bulk | C400 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.064 (1.63mm) | 423°F (217°C) | No-Clean | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD291AXSOLDER PASTE NO-CLEAN 63/37 5CC Chip Quik Inc. |
106 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
SMD291AX10T5SOLDER PASTE NO CLEAN T5 10CC Chip Quik Inc. |
2,716 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMDLTLFP10T5SOLDER PASTE LOW TEMP LF T5 10CC Chip Quik Inc. |
2,686 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
TS391SNL250THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
3,529 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
SMD291AX50T3SLDR PASTE NO-CLN SN63/PB37 50G Chip Quik Inc. |
2,094 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMD291AX10SOLDER PASTE NO-CLEAN 63/37 10CC Chip Quik Inc. |
3,166 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
NC2SW.020 0.3OZSOLDER WIRE MINI POCKET PACK 60/ Chip Quik Inc. |
2,338 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Tube, 0.3 oz (8.51g) | - | - |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
