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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4900-18GSAC305, Sn96.2Ag2.8Cu0.4 2PK MG Chemicals |
3,329 | - |
RFQ |
Fiche technique |
Box | 4900 | Active | Wire Solder | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032 (0.81mm) | 423°F (217°C) | No-Clean, Rosin Activated (RA) | 21 AWG, 21 SWG | - | Lead Free | Tube, 0.74 oz (21g) | - | - |
|
SSLFNC-50GSAC 305 LEAD FREE SOLDER PASTE T SRA Soldering Products |
2,556 | - |
RFQ |
Fiche technique |
Bag | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
TS391LT50THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,510 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMD2050-25000SOLDER SPHERES SAC305 .024 DIAM Chip Quik Inc. |
2,054 | - |
RFQ |
Fiche technique |
Jar | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.024 (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
WBNCSAC20-4OZLEAD FREE NO-CLEAN FLUX CORE SIL SRA Soldering Products |
2,061 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
TS391AX10THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,639 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
TS391LT10THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
2,648 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMD4300AX10T5SOLDER PASTE WATER SOL T5 10CC Chip Quik Inc. |
2,740 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 5 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
WB63/37MADE IN USA 63/37 ALLOY 1 LB SOL SRA Soldering Products |
2,557 | - |
RFQ |
Fiche technique |
Bag | SUPER-PURE™ | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | - | Bar, 1 lb (454g) | - | - |
|
24-7040-8834SOLDER FLUX-CORED/245 .020 1LB S Kester Solder |
3,010 | - |
RFQ |
Fiche technique |
Bulk | 245 | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.020 (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
24-7050-0061SOLDER FLUX-CORED/44 .062 1LB S Kester Solder |
3,134 | - |
RFQ |
Fiche technique |
Bulk | 44 | Active | Wire Solder | Sn96.3Ag3.7 (96.3/3.7) | 0.062 (1.57mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
24-7150-8806SOLDER FLUX-CORED/245 .015 1LB Kester Solder |
2,638 | - |
RFQ |
Fiche technique |
Bulk | 245 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.015 (0.38mm) | 354°F (179°C) | No-Clean | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
|
92-7068-8825SOLDER FLUX-CORED/245 .040 500G Kester Solder |
3,789 | - |
RFQ |
Fiche technique |
Bulk | 245 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.040 (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 18 AWG, 19 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - |
|
70-4021-0819SOLDER PASTE NO CLEAN 750GM Kester Solder |
3,032 | - |
RFQ |
Fiche technique |
Bulk | NP505-HR | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Cartridge, 24.69 oz (700g) | 12 Months | Date of Manufacture |
|
|
70-1903-0911SOLDER PASTE WATER SOLUBLE 600GM Kester Solder |
3,793 | - |
RFQ |
Fiche technique |
Bulk | R520A | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | 4 | Lead Free | Cartridge, 21.16 oz (600g) | 4 Months | Date of Manufacture |
|
395437HMP 366 3% .028DIA 21AWG Multicore |
3,869 | - |
RFQ |
Fiche technique |
Bulk | 366 | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.028 (0.71mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 21 AWG, 22 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - |
|
70-3205-0819SOLDER PASTE NXG1 NO CLEAN 750GM Kester Solder |
3,967 | - |
RFQ |
Fiche technique |
Bulk | NXG1 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 3 | Lead Free | Cartridge, 24.69 oz (700g) | 8 Months | Date of Manufacture |
|
TS391SNL10THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc. |
3,131 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMD4300SNL10T5SLD PASTE LF WATER SOL T5 10CC Chip Quik Inc. |
3,737 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2SWLF.015 8OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
3,581 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015 (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
