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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD2195SOLDER SPHERES SN63/PB37 .022 ( Chip Quik Inc. |
2,509 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.022 (0.56mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD2180SOLDER SPHERES SN63/PB37 .016 ( Chip Quik Inc. |
3,631 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.016 (0.40mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
RASWLF.020 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,627 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
RASWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
2,967 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
SMD2170SOLDER SPHERES SN63/PB37 .014 ( Chip Quik Inc. |
2,244 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014 (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD2140SOLDER SPHERES SN63/PB37 .008 ( Chip Quik Inc. |
2,140 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.008 (0.20mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD2036SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,800 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.018 (0.46mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2032SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,578 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016 (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2028SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,337 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.014 (0.36mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2020SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,489 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010 (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD2016SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
3,954 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008 (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
70-1002-0510SOLDER 500G JAR, SN63/PB37 Kester Solder |
3,761 | - |
RFQ |
Fiche technique |
Jar | HydroMark 531 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture |
|
70-4823-0911NP560 SN96.5AG3.0CU0.5 T4 600 G Kester Solder |
3,712 | - |
RFQ |
Fiche technique |
Bulk | NP560 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Cartridge, 21.16 oz (600g) | 12 Months | Date of Manufacture |
|
T0051404999WSW SCN M1 SN0,6CU0,05NI3,5% Apex Tool Group |
3,100 | - |
RFQ |
Fiche technique |
Spool | Weller® | Active | Wire Solder | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | - | - | No-Clean | - | - | Lead Free | Spool, 0.7 oz (20g) | - | - |
|
GA100-10GGALLIUM METAL 99.99% PURE 10G IN Chip Quik Inc. |
2,941 | - |
RFQ |
Fiche technique |
Bulk | CHIPQUIK® | Active | Solder Paste | Ga100 | - | 85.57°F (29.76°C) | - | - | - | - | Syringe, 0.35 oz (9.922g) | - | - |
|
WBWSSAC31-2OZSOLDER NC SAC305 .031 2 OZ SRA Soldering Products |
3,423 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | 0.031 (0.79mm) | - | Water Soluble | - | - | Lead Free | Spool, 2 oz (56.70g) | 24 Months | Date of Manufacture |
|
SMD3SWLT.047 2OZSOLDER WIRE SN42/BI58 .047 2OZ Chip Quik Inc. |
3,979 | - |
RFQ |
Fiche technique |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.047 (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
35232SOLDER, COIL, LEAD-FREE (6 PACK) Master Appliance Co |
2,815 | - |
RFQ |
Box | - | Active | Wire Solder | - | - | - | - | - | - | Lead Free | Tube | - | - | |
|
WBWSSAC20-4OZSOLDER NC SAC305 .020 4 OZ SRA Soldering Products |
2,293 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | - | Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | 24 Months | Date of Manufacture |
|
T0051402499WSW SAC M1 SN3,0AG0,5CU3,5% Apex Tool Group |
2,399 | - |
RFQ |
Fiche technique |
Spool | Weller® | Active | Wire Solder | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | - | - | No-Clean | - | - | Lead Free | Spool, 0.7 oz (20g) | - | - |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
