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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDLTLFP10T4SOLDER PASTE LOW TEMP T4 10CC Chip Quik Inc. |
2,453 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
NC191LT50T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,271 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
SMD2024-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,992 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012 (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
|
SMD291SNL10T4SLDR PST NO-CLEAN SAC305 T4 10CC Chip Quik Inc. |
3,151 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD3SW.020 4OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
3,491 | - |
RFQ |
Fiche technique |
Bulk | SMD3 | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020 (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
NC191SNL35T5SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
2,776 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
4865-227GSOLDER NO-CLEAN 63/37 1/2 LB MG Chemicals |
2,615 | - |
RFQ |
Fiche technique |
Spool | 4860 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | - |
|
4887-227GSOLDER RA 63/37 .050 1/2 LBS MG Chemicals |
3,032 | - |
RFQ |
Fiche technique |
Spool | 4880 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.050 (1.27mm) | 361°F (183°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | - |
|
RASW.031 1LBSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
2,428 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - |
|
T0051386570WSW SAC M1 SN3,0AG0,5CU3,5% Apex Tool Group |
3,318 | - |
RFQ |
Fiche technique |
Spool | Weller® | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008 (0.20mm) | - | No-Clean | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - |
|
NC191AX250SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3,813 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture |
|
4886-454GSOLDER RA 63/37 1 LB MG Chemicals |
2,687 | - |
RFQ |
Fiche technique |
Spool | 4880 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.040 (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - |
|
RASWLF.031 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,736 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
NC191SNL250SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
2,340 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
NC191LT250SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,780 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
RASWLF.015 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,685 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - |
|
NC191LT250T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
3,459 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
|
SMD3SWLT.040 50GSN42/BI58 2.2% FLUX CORE SOLDER Chip Quik Inc. |
3,401 | - |
RFQ |
Fiche technique |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 1.8 oz (50g) | - | - |
|
BARSN96.5AG3.0CU0.5SOLDER BAR SN96.5/AG3.0/CU0.5 1L Chip Quik Inc. |
3,950 | - |
RFQ |
Fiche technique |
Bulk | Super Low Dross™ | Active | Bar Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - |
|
NC191SNL250T5SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
3,957 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
