NXP USA Inc. MCF54452CVP200

Numéro de pièce
MCF54452CVP200
Fabricant
NXP USA Inc.
Catégorie :
Embedded – Mikrocontroller
Emballage
360-BBGA
Fiche technique
Fudong Communication (Shenzhen) Group Co., Ltd.MCF54452CVP200.pdf
Description
IC MCU 32BIT ROMLESS 360TEPBGA
Quantité

Prix unitaire$0

Prix total$0

Paiement
payment
Expédition
payment

Product details

1. How to order MCF54452CVP200 on Fudong Communication (Shenzhen) Group Co., Ltd.?

Currently, Fudong Communication (Shenzhen) Group Co., Ltd. only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

2. How does Fudong Communication (Shenzhen) Group Co., Ltd. guarantee that MCF54452CVP200 is from the original manufacturer or authorized agents?

We have a professional and experienced quality control team to strictly verify and test the MCF54452CVP200. All suppliers must pass our qualification reviews before they can publish their products including MCF54452CVP200 on Fudong Communication (Shenzhen) Group Co., Ltd.; we pay more attention to the channels and quality of MCF54452CVP200 products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the MCF54452CVP200 price and inventory displayed accurate?

The price and inventory of MCF54452CVP200 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

Wire Transfer, PayPal, Alipay, Wechat, Credit Card, Western Union, MoneyGram, and Escrow are all acceptable.

Warm Tips: Some orders in certain payment forms may require handling fee.

5. How is the shipping arranged?

Customers can choose industry-leading freight companies, including DHL, UPS, FedEx, TNT, and Registered Mail. Shipping insurance is also available.

Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of MCF54452CVP200?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the MCF54452CVP200 we delivered, we will accept the replacement or return of the MCF54452CVP200 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of MCF54452CVP200.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as MCF54452CVP200 pin diagram, MCF54452CVP200 datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Image MCF54452VR266 MCF54450VM240 MCF54452CVP200 MCF54453CVP200 MCF54452VP266
Numéro de pièce MCF54452VR266 MCF54450VM240 MCF54452CVP200 MCF54453CVP200 MCF54452VP266
Fabricant NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc. NXP USA Inc.
Package/Case 360-BBGA 360-BBGA 360-BBGA 360-BBGA 360-BBGA
Packaging - - - - -
Series MCF5445x MCF5445x MCF5445x MCF5445x MCF5445x
ProductStatus RoHS RoHS RoHS RoHS RoHS
CoreProcessor 200MHz 200MHz 200MHz 200MHz 200MHz
CoreSize 32K x 8 32K x 8 32K x 8 32K x 8 32K x 8
Speed 32-Bit 32-Bit 32-Bit 32-Bit 32-Bit
Connectivity - - - - -
Peripherals Active Active Active Active Active
NumberofI/O DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT
ProgramMemorySize I²C, SPI, SSI, UART/USART, USB OTG I²C, SPI, SSI, UART/USART, USB OTG I²C, SPI, SSI, UART/USART, USB OTG I²C, SPI, SSI, UART/USART, USB OTG I²C, SPI, SSI, UART/USART, USB OTG
ProgramMemoryType Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
EEPROMSize 132 132 132 132 132
RAMSize Coldfire V4 Coldfire V4 Coldfire V4 Coldfire V4 Coldfire V4
Voltage-Supply(Vcc/Vdd) - - - - -
DataConverters External, Internal External, Internal External, Internal External, Internal External, Internal
OscillatorType - - - - -
OperatingTemperature ROMless ROMless ROMless ROMless ROMless
MountingType -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)

MCF54452CVP200 Informations pertinentes

Inclut les pièces suivantes "MCF54452CVP200" ISSI, solutions de silicium intégrées de lentreprise MCF54452CVP200.

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