AMD Xilinx XCZU4CG-1FBVB900E

Numéro de pièce
XCZU4CG-1FBVB900E
Fabricant
AMD Xilinx
Catégorie :
Embedded – System-on-Chip (SoC)
Emballage
900-BBGA, FCBGA
Fiche technique
Fudong Communication (Shenzhen) Group Co., Ltd.XCZU4CG-1FBVB900E.pdf
Description
IC SOC CORTEX-A53 900FCBGA
Quantité

Prix unitaire$0

Prix total$0

Paiement
payment
Expédition
payment

Product details

1. How to order XCZU4CG-1FBVB900E on Fudong Communication (Shenzhen) Group Co., Ltd.?

Currently, Fudong Communication (Shenzhen) Group Co., Ltd. only provide peer-to-peer order processing. While you submit the RFQ, our professional agent will contact you with the competitive prices in the global market, and our agent will prompt you to finish the order if you accept our offers.

2. How does Fudong Communication (Shenzhen) Group Co., Ltd. guarantee that XCZU4CG-1FBVB900E is from the original manufacturer or authorized agents?

We have a professional and experienced quality control team to strictly verify and test the XCZU4CG-1FBVB900E. All suppliers must pass our qualification reviews before they can publish their products including XCZU4CG-1FBVB900E on Fudong Communication (Shenzhen) Group Co., Ltd.; we pay more attention to the channels and quality of XCZU4CG-1FBVB900E products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the XCZU4CG-1FBVB900E price and inventory displayed accurate?

The price and inventory of XCZU4CG-1FBVB900E fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

Wire Transfer, PayPal, Alipay, Wechat, Credit Card, Western Union, MoneyGram, and Escrow are all acceptable.

Warm Tips: Some orders in certain payment forms may require handling fee.

5. How is the shipping arranged?

Customers can choose industry-leading freight companies, including DHL, UPS, FedEx, TNT, and Registered Mail. Shipping insurance is also available.

Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCZU4CG-1FBVB900E?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCZU4CG-1FBVB900E we delivered, we will accept the replacement or return of the XCZU4CG-1FBVB900E only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCZU4CG-1FBVB900E.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as XCZU4CG-1FBVB900E pin diagram, XCZU4CG-1FBVB900E datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Image XCZU4CG-1SFVC784I XCZU4CG-1FBVB900E XCZU4CG-2SFVC784I XCZU3CG-1SFVC784E XCZU2CG-1SBVA484I
Numéro de pièce XCZU4CG-1SFVC784I XCZU4CG-1FBVB900E XCZU4CG-2SFVC784I XCZU3CG-1SFVC784E XCZU2CG-1SBVA484I
Fabricant AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx AMD Xilinx
Package/Case 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA 900-BBGA, FCBGA
Packaging Tray Tray Tray Tray Tray
Series Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC CG Zynq® UltraScale+™ MPSoC CG
ProductStatus Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
FlashSize - - - - -
RAMSize 256KB 256KB 256KB 256KB 256KB
Peripherals DMA, WDT DMA, WDT DMA, WDT DMA, WDT DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 1.2GHz 500MHz, 1.2GHz 500MHz, 1.2GHz 500MHz, 1.2GHz 500MHz, 1.2GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
OperatingTemperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)

XCZU4CG-1FBVB900E Informations pertinentes

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