+86 075582561136
Télécharger le BOM
Soudure
| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDLTLFPSOLDER PASTE LOW TEMP 5CC W/TIP Chip Quik Inc. |
2,675 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
SMDSW.015 100GSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
2,714 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015 (0.38mm) | 361°F (183°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - |
|
SMD2SWLF.031 2OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
2,986 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031 (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
SMDSW.031 4OZSOLDER WIRE NO-CLEAN 63/37 4OZ. Chip Quik Inc. |
3,161 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031 (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
SMD2195-25000SOLDER SPHERES SN63/PB37 .022 ( Chip Quik Inc. |
2,898 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.022 (0.56mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMDALALUMINUM SOLDER PASTE WATER-SOLU Chip Quik Inc. |
2,909 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Syringe, 0.35 oz (10g), 5cc | 12 Months | Date of Manufacture |
|
NC191SNL15T5SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
3,792 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
SMDSW.020 4OZSOLDER WIRE NO-CLEAN 63/37 4OZ. Chip Quik Inc. |
3,652 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
NC191LT35SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,386 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD2185-25000SOLDER SPHERES SN63/PB37 .018 ( Chip Quik Inc. |
2,520 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.018 (0.46mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMDSWLF.031 2OZSLD WIRE NO-CLEAN 96.5/3/.5 2OZ. Chip Quik Inc. |
2,551 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
SMDSWLF.020 2OZSLD WIRE NO-CLEAN 96.5/3/.5 2OZ. Chip Quik Inc. |
3,286 | - |
RFQ |
Fiche technique |
Spool | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020 (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
SMDLTLFPT4SOLDER PASTE NO CLEAN SN42/BI57. Chip Quik Inc. |
2,652 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
WB63/37-1/2LBMADE IN USA SN63/PB37 ALLOY 1/2 SRA Soldering Products |
2,825 | - |
RFQ |
Fiche technique |
Bag | SUPER-PURE™ | Active | Bar Solder | Sn63Pb37 (63/37) | - | - | - | - | - | Leaded | Bar, 0.5 lb (266.79g) | - | - |
|
SMD2180-25000SOLDER SPHERES SN63/PB37 .016 ( Chip Quik Inc. |
2,349 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.016 (0.40mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMD291SNLT4SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
2,887 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
T0051404699WSW SCN M1 SN0,6CU0,05NI3,5% Apex Tool Group |
2,095 | - |
RFQ |
Fiche technique |
Spool | Weller® | Active | Wire Solder | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | 0.039 (0.99mm) | - | No-Clean | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - |
|
SMD2170-25000SOLDER SPHERES SN63/PB37 .014 ( Chip Quik Inc. |
3,052 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.014 (0.36mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture |
|
SMDSWLF.006 2GSOLDER WIRE SN96.5/AG3/CU0.5 Chip Quik Inc. |
3,727 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006 (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.07 oz (2g) | - | - |
|
T0051404399WSW SCN M1 SN0,6CU0,05NI3,5% Apex Tool Group |
3,995 | - |
RFQ |
Fiche technique |
Spool | Weller® | Active | Wire Solder | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | 0.031 (0.79mm) | - | No-Clean | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
