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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
T0051403199WSW SNPB L1, 0.8MM, 100G Apex Tool Group |
2,069 | - |
RFQ |
Fiche technique |
Spool | Weller® | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031 (0.79mm) | - | No-Clean | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - |
|
RASW.015 100GSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
3,412 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.015 (0.38mm) | 361°F (183°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - |
|
SMD2SW.020 4OZSOLDER WIRE 60/40 TIN/LEAD NO-CL Chip Quik Inc. |
3,039 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020 (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - |
|
SMD291SNL50T3SLDR PASTE NO-CLN SAC305 50G Chip Quik Inc. |
3,323 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
NC191AX35SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
2,379 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
SMD291AXT4SOLDER PASTE NO CLEAN 63SN/37PB Chip Quik Inc. |
3,927 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture |
|
SMDSWLF.015 2OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,785 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015 (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 2 oz (56.70g) | - | - |
|
NC191SNL35SMOOTH FLOW LEAD-FREE SOLDER PAS Chip Quik Inc. |
2,903 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
NC191LT50SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,499 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
SMDIN100INDIUM SOLDER WIRE (IN100) 0.031 Chip Quik Inc. |
2,711 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Wire Solder | In100 (100) | 0.031 (0.79mm) | 315°F (157°C) | - | 20 AWG, 21 SWG | - | Lead Free | Spool | - | - |
|
SMDLTLFP50T3SLDR PASTE NO-CLN SN42/BI58 50G Chip Quik Inc. |
2,060 | - |
RFQ |
Fiche technique |
Jar | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture |
|
SMDLTLFP10SOLDER PASTE LOW TEMP 10CC W/TIP Chip Quik Inc. |
2,167 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMDLTLFPT5SOLDER PASTE NO CLEAN SN42/BI57. Chip Quik Inc. |
2,655 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
NC191LT35T5SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc. |
2,775 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture |
|
SMD291AX10T4SLDR PST NO-CLEAN 63/37 T4 10CC Chip Quik Inc. |
3,911 | - |
RFQ |
Fiche technique |
Syringe | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture |
|
NC191AX50T5SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3,227 | - |
RFQ |
Fiche technique |
Bulk | Smooth Flow™ | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMD291SNLT5SOLDER PASTE NO CLEAN LEAD-FREE Chip Quik Inc. |
2,403 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture |
|
SMDAL50ALUMINUM SOLDER PASTE WATER-SOLU Chip Quik Inc. |
3,008 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture |
|
SMDAL10ALUMINUM SOLDER PASTE WATER-SOLU Chip Quik Inc. |
2,332 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Syringe, 0.88 oz (25g), 10cc | 12 Months | Date of Manufacture |
|
SMD2032-25000SOLDER SPHERES SN96.5/AG3.0/CU0. Chip Quik Inc. |
2,140 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016 (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
