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Numéro de pièce du fabricant	Disponibilité en stock	Prix	Quantité	Fiche technique	Packaging	Series	ProductStatus	Type	Composition	Diameter	MeltingPoint	FluxType	WireGauge	MeshType	Process	Form	ShelfLife	ShelfLifeStart
CWSAC WRMAP3 .062 SN96.5AG3CU.5 WRMAP3 .062 1# SPL Amerway Inc	3,595	-	RFQ		Box	-	Active	Wire Solder	Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)	0.062 (1.57mm)	-	-	-	-	-	Spool, 1 lb (453.59g)	-	-
SMDSWLF.059 3.3 1LB SOLDER WIRE SN96.5/AG3.0/CU0.5 Chip Quik Inc.	3,664	-	RFQ	Fiche technique	Bulk	-	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.059 (1.50mm)	423 ~ 428°F (217 ~ 220°C)	No-Clean, Water Soluble	-	-	Lead Free	Spool, 1 lb (453.59g)	-	-
CWSAC WRMAP .015 SN96.5AG3CU.5 WRMAP3 .015 1# SPL Amerway Inc	2,122	-	RFQ		Box	-	Active	Wire Solder	Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)	0.015 (0.38mm)	-	-	-	-	-	Spool, 1 lb (453.59g)	-	-
CWSAC NC.015 1# SN96.5AG3CU.5 NCCW2.015 1# SPL Amerway Inc	2,856	-	RFQ		Box	-	Active	Wire Solder	Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)	0.015 (0.38mm)	-	-	-	-	-	Spool, 1 lb (453.59g)	-	-
CWSAC WRAP .015 SN96.5AG3CU.5 WRAP3 0.15 1# SPL Amerway Inc	2,224	-	RFQ		Box	-	Active	Wire Solder	Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)	0.015 (0.38mm)	-	-	-	-	-	Spool, 1 lb (453.59g)	-	-
HV018S HVTOOLS PUMP FOR CLEAN SOLDER Hvtools	630	-	RFQ		Box	-	Active	-	-	-	-	-	-	-	-	-	-	-
HV018B HVTOOLS PUMP FOR CLEAN SOLDER Hvtools	605	-	RFQ		Box	-	Active	-	-	-	-	-	-	-	-	-	-	-
HV0006 HVTOOLS ALL PURPOSE SOLDER Hvtools	593	-	RFQ		Box	-	Active	Wire Solder	-	-	-	-	-	-	-	Spool, 3.53 oz (100g)	-	-
WBCANFIELD6040 Canfield 60/40 Solder 1 Lb Roll SRA Soldering Products	298	-	RFQ		Bag	-	Active	Wire Solder	Sn60Pb40 (60/40)	0.125 (3.18mm)	363°F (184°C)	Rosin Activated (RA)	-	-	Leaded	Spool, 1 lb (453.592g)	-	-
395439 HMP 366 3% .050DIA 16AWG Multicore	240	-	RFQ	Fiche technique	Bulk	366	Active	Wire Solder	Pb93.5Sn5Ag1.5 (93.5/5/1.5)	0.050 (1.27mm)	565 ~ 574°F (296 ~ 301°C)	Rosin Activated (RA)	16 AWG, 18 SWG	-	Leaded	Spool, 17.64 oz (500g)	-	-
RCBLF22701062P BLF 227 ROSIN FLUX 1 LB. 062 DIA Canfield Technologies	2,282	-	RFQ		Spool	*	Active	-	-	-	-	-	-	-	-	-	-	-
WCBLF22701062 BLF227 WATER SOLUBLE 1 LB. .062 Canfield Technologies	2,972	-	RFQ		Spool	*	Active	-	-	-	-	-	-	-	-	-	-	-
CC96L2020ESAC SAC305 NO CLEAN FLUX 8 OZ .020 D Canfield Technologies	2,014	-	RFQ		Spool	*	Active	-	-	-	-	-	-	-	-	-	-	-
WC96L2020P SAC 305 WATER SOLUBLE FLUX 8 OZ Canfield Technologies	3,153	-	RFQ		Spool	*	Active	-	-	-	-	-	-	-	-	-	-	-
RC96L2020CQPJ SAC 305 ROSIN FLUX 8 OZ. .020 DI Canfield Technologies	3,725	-	RFQ		Spool	*	Active	-	-	-	-	-	-	-	-	-	-	-
WCBLF22701031 BLF 227 WATER SOLUBLE FLUX 1 LB Canfield Technologies	3,165	-	RFQ		Spool	*	Active	-	-	-	-	-	-	-	-	-	-	-
CCBLF22701031P BLF 227 NO CLEAN FLUX 1 LB. 031D Canfield Technologies	2,650	-	RFQ		Spool	*	Active	-	-	-	-	-	-	-	-	-	-	-
RCBLF22701031P BLF 227 ROSIN FLUX 1 LB. 031DIA Canfield Technologies	3,755	-	RFQ		Spool	*	Active	-	-	-	-	-	-	-	-	-	-	-
733001 97SC C511 2% .022DIA 22AWG 24SWG Multicore	375	-	RFQ	Fiche technique	Bulk	C511™	Active	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	0.022 (0.56mm)	423°F (217°C)	No-Clean	23 AWG, 24 SWG	-	Lead Free	Spool, 8.8 oz (250g)	-	-
6059 SOLDER 60/38/AG2 SILVER BEARING GC Electronics	169	-	RFQ		Bulk	*	Active	-	-	-	-	-	-	-	-	-	-	-