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| Photo : | Numéro de pièce du fabricant | Disponibilité en stock | Prix | Quantité | Fiche technique | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
JPAGSC0501PSIL CAN 5 BRAZING ALLOY Canfield Technologies |
2,824 | - |
RFQ |
Fiche technique |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - |
|
CCBLF22701020BLF 227 NO CLEAN FLUX 1 LB. .020 Canfield Technologies |
2,856 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
SMD3SWLT.040 10GSN42/BI58 2.2% FLUX CORE SOLDER Chip Quik Inc. |
3,012 | - |
RFQ |
Fiche technique |
Bulk | SMD3 | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - |
|
RASWLF.031 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
3,557 | - |
RFQ |
Fiche technique |
Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - |
|
SMD2SWLT.040 10GSN42/BI57.6/AG0.4 2.2% FLUX CORE Chip Quik Inc. |
3,680 | - |
RFQ |
Fiche technique |
Bulk | SMD2 | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - |
|
SMDIN97AG3INDIUM SOLDER WIRE (IN97/AG3) 0. Chip Quik Inc. |
2,289 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Wire Solder | In97Ag3 (97/3) | 0.031 (0.79mm) | 289°F (143°C) | - | 20 AWG, 21 SWG | - | Lead Free | Spool | 24 Months | Date of Manufacture |
|
SMDSWLT.040 10GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
3,083 | - |
RFQ |
Fiche technique |
Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 0.35 oz (10g) | - | - |
|
WCBLF22701020BLF 227 WATER SOLUBLE FLUX 1 LB. Canfield Technologies |
3,809 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
RCBLF22701020PBLF227 ROSIN FLUX 1 LB. .020 DIA Canfield Technologies |
2,477 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
CCBLF22701062BLF 227 NO CLEAN 1 LB. 062 CORE Canfield Technologies |
100 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
WC9601062PSACSAC 305 WATER SOLUBLE FLUX 1 LB. Canfield Technologies |
2,957 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
RC9601062PSACSAC 305 ROSIN FLUX 1 LB. 062 DIA Canfield Technologies |
3,356 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
RC9601031PSACSAC 305 ROSIN FLUX 1 LB .031 DIA Canfield Technologies |
100 | - |
RFQ |
Fiche technique |
Spool | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Rosin Mildly Activated (RMA) | - | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
CC9601031PAG3SAC 305 NO CLEAN 1 LB. .031 DIA Canfield Technologies |
3,907 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
RC9601020CQPJSAC 305 ROSIN FLUX 1 LB .020 DIA Canfield Technologies |
3,467 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
WC9601020PSAC 305 WATER SOLUBLE FLUX 1 LB. Canfield Technologies |
3,614 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
CC9601020ESACSAC305 NO CLEAN FLUX 1 LB. .020 Canfield Technologies |
3,671 | - |
RFQ |
Spool | * | Active | - | - | - | - | - | - | - | - | - | - | - | |
|
67382997SC 400 2% .032DIA 20AWG Multicore |
113 | - |
RFQ |
Fiche technique |
Bulk | C400 | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032 (0.81mm) | 423°F (217°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
73300297SC C511 2% .032DIA 20AWG Multicore |
230 | - |
RFQ |
Fiche technique |
Bulk | C511™ | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.032 (0.81mm) | 423°F (217°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - |
|
104209796S ARAX 4C 1.6MM 0.5KG AM Multicore |
489 | - |
RFQ |
Fiche technique |
Bulk | ARAX | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.063 (1.60mm) | 430°F (221°C) | - | 14 AWG, 16 SWG | - | Lead Free | Spool, 17.64 oz (500g) | - | - |
- 1500+ Moyenne quotidienne des demandes de devis (RFQ)
- 20,000.000 Unité standard du produit
- 1800+ Fabricants du monde entier
- 15,000+ Stock disponible
